LOWER LINER WITH INTEGRATED FLOW EQUALIZER AND IMPROVED CONDUCTANCE

• US 20120325406A1
• Filed: 09/07/2012
• Published: 12/27/2012
• Est. Priority Date: 04/07/2008
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: CARDUCCI, James D., NGUYEN, Andrew, BALAKRISHNA, Ajit, KUTNEY, Michael C.
• Granted Patent: US 8,440,019 B2
• Time in Patent Office: Days
• US Class Current: 156/345.34
• CPC Class Codes: H01J 37/32082 Radio frequency generated discharge H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence
• CPC Class Codes: H01J 37/32495 Means for protecting the vessel against plasma
• CPC Class Codes: H01J 37/32623 Mechanical discharge control means
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: Y10T 428/13 Hollow or container type article [e.g., tube, vase, etc.]

Abstract

A plasma processing chamber has a lower liner with an integrated flow equalizer. In an etching process, the processing gases may be unevenly drawn from the processing chamber which may cause an uneven etching of the substrate. The integrated flow equalizer is configured to equalize the flow of the processing gases evacuated from the chamber via the lower liner.

Claims

1. An annular chamber liner for a plasma chamber, comprising:

a bottom wall; and

an outer wall sloping upwardly and outwardly from the bottom wall,

wherein the annular chamber liner has a plurality of slots extending through the outer wall, and wherein the plurality of slots are arranged such that at least one slot is present within each quadrant of the annular chamber liner.

2. The annular chamber liner of claim 1, wherein the plurality of slots are separated by a plurality of structural ribs.

3. The annular chamber liner of claim 1, wherein a periphery of the outer wall is configured for coupling with an upper chamber liner.

4. The annular chamber liner of claim 3, wherein the periphery of the outer wall is configured for electrically coupling with the upper chamber liner.

5. The annular chamber liner of claim 1, wherein the bottom wall is configured for coupling with a body of the plasma chamber.

6. The annular chamber liner of claim 1, wherein the plurality of slots are configured for drawing processing gases therethrough.

7. An apparatus for plasma processing, comprising:

a chamber body;

a first chamber liner disposed within the chamber body; and

a second chamber liner disposed within the chamber body below the first chamber liner and electrically coupled to the first chamber liner, wherein the second chamber liner comprises;

a bottom wall; and

an outer wall sloping upwardly and outwardly from the bottom wall, wherein the second chamber liner has a plurality of slots extending through the outer wall, and wherein the plurality of slots are arranged such that at least one slot is present within each quadrant of the second chamber liner.

8. The apparatus of claim 7, wherein the second chamber liner is positioned such that an annular plenum is defined between the outer wall of the second chamber liner and the chamber body.

9. The apparatus of claim 7, wherein the annular plenum is in fluid communication with an exhaust port and the plurality of slots.

10. The apparatus of claim 7, wherein the bottom wall is coupled to a bottom wall of the chamber body.

11. A plasma processing apparatus, comprising:

a chamber body;

a substrate support pedestal disposed in the chamber body;

a gas introduction showerhead disposed in the chamber opposite the substrate support;

an upper chamber liner disposed in the chamber body such that the substrate support pedestal, the gas introduction showerhead, and the first chamber liner at least partially enclose a processing area; and

a lower chamber liner disposed within the chamber body below the upper chamber liner and electrically coupled to the upper chamber liner, wherein the lower chamber liner comprises;

a bottom wall; and

an outer wall sloping upwardly and outwardly from the bottom wall, wherein the second chamber liner has a plurality of slots extending through the outer wall, and wherein the plurality of slots are arranged such that at least one slot is present within each quadrant of the second chamber liner.

12. The apparatus of claim 11, wherein the lower chamber liner is positioned such that an annular plenum is defined between the outer wall of the lower chamber liner and the chamber body.

13. The apparatus of claim 12, wherein the annular plenum is in fluid communication with an exhaust port and the plurality of slots.

14. The apparatus of claim 11, further comprising an annular baffle disposed around the substrate support pedestal.

15. The apparatus of claim 11, wherein the lower chamber liner is coupled to the chamber body.