SEMICONDUCTOR DEVICE
First Claim
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1. A semiconductor device, comprising:
- a semiconductor substrate; and
a semiconductor element configured to comprise an FET which is formed on the semiconductor substrate and comprises a different threshold voltage depending on an OFF state and an ON state,wherein the semiconductor element comprises;
an insulating film disposed above a part where a channel of the semiconductor substrate is formed;
a gate electrode disposed above the insulating film; and
a charge trap film disposed between the insulating film and the gate electrode, and to exchange more electrons with the gate electrode than with the channel.
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Abstract
A semiconductor device has a semiconductor substrate, and a semiconductor element having an FET on the semiconductor substrate and comprises a different threshold voltage depending on an OFF state and an ON state. The semiconductor element has an insulating film disposed above a part where a channel of the semiconductor substrate is formed, a gate electrode disposed above the insulating film, and a charge trap film disposed between the insulating film and the gate electrode, and to exchange more electrons with the gate electrode than with the channel.
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Citations
20 Claims
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1. A semiconductor device, comprising:
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a semiconductor substrate; and a semiconductor element configured to comprise an FET which is formed on the semiconductor substrate and comprises a different threshold voltage depending on an OFF state and an ON state, wherein the semiconductor element comprises; an insulating film disposed above a part where a channel of the semiconductor substrate is formed; a gate electrode disposed above the insulating film; and a charge trap film disposed between the insulating film and the gate electrode, and to exchange more electrons with the gate electrode than with the channel. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A semiconductor device, comprising:
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a semiconductor substrate; and a semiconductor element configured to be formed of an FET which is formed on the semiconductor substrate and changes a threshold voltage depending on an OFF state and an ON state, the semiconductor element includes; an insulating film configured to be formed on the semiconductor substrate; a charge trap film configured to be formed on the insulating film; and a gate electrode configured to be arranged to be in contact with the charge trap film, wherein the charge trap film is an SiNx film, the x representing a mole ratio of N to Si and having a value within a range of 0.67<
x<
1.33,the charge trap film comprises a film thickness Tct having a value within a range of 0.34 nm<
Tct<
7 nm,the insulating film is an SiON film in which a mole ratio of N to a sum of Si, O, and N expressed as {N/(Si+O+N)} is a value within a range of 0≦
{N/(Si+O+N)}<
0.35, andthe insulating film comprises a film thickness Tox comprising a value within a range of 0.64 nm<
Tox. - View Dependent Claims (19, 20)
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Specification