WIRELESS COMMUNICATION MODULE AND WIRELESS COMMUNICATION DEVICE
First Claim
1. A wireless communication module comprising:
- a flexible multilayer substrate including a plurality of stacked flexible base materials and a cavity provided therein;
a wireless IC chip disposed in the cavity;
a sealant filled in the cavity so as to cover the wireless IC chip, the sealant being harder than the flexible base materials; and
a loop-shaped electrode including a coil pattern provided on or in the flexible multilayer substrate, the loop-shaped electrode being coupled to the wireless IC chip.
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Accused Products
Abstract
A wireless communication module and a wireless communication device that are less likely to become detached even when attached to a flexible base substrate and have a reduced height includes a flexible multilayer substrate including a plurality of stacked flexible base materials and a cavity provided therein, a wireless IC chip arranged in the cavity, and a sealant filled in the cavity so as to cover the wireless IC chip. The sealant is a material that is harder than the flexible base materials. The flexible multilayer substrate includes a loop-shaped electrode defined by coil patterns. The loop-shaped electrode is electrically connected to the wireless IC chip.
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Citations
15 Claims
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1. A wireless communication module comprising:
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a flexible multilayer substrate including a plurality of stacked flexible base materials and a cavity provided therein; a wireless IC chip disposed in the cavity; a sealant filled in the cavity so as to cover the wireless IC chip, the sealant being harder than the flexible base materials; and a loop-shaped electrode including a coil pattern provided on or in the flexible multilayer substrate, the loop-shaped electrode being coupled to the wireless IC chip. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A wireless communication device comprising:
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a wireless communication module; and a flexible base substrate on which the wireless communication module is mounted;
whereinthe wireless communication module includes; a flexible multilayer substrate including a plurality of stacked flexible base materials and a cavity provided therein; a wireless IC chip disposed in the cavity; a sealant filled in the cavity so as to cover the wireless IC chip, the sealant being harder than the flexible base materials; and a loop-shaped electrode including a coil pattern provided on or in the flexible multilayer substrate, the loop-shaped electrode being coupled to the wireless IC chip. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15)
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Specification