Hybrid Solid State Emitter Printed Circuit Board for Use in a Solid State Directional Lamp

• US 20120327670A1
• Filed: 06/23/2011
• Published: 12/27/2012
• Est. Priority Date: 06/23/2011
• Status: Active Grant

• Current Assignee: IDEAL Industries Lighting, LLC (Ideal Industries Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Pickard, Paul, Progl, Curt
• Granted Patent: US 8,777,463 B2
• Time in Patent Office: Days
• US Class Current: 362/373
• CPC Class Codes: F21K 9/233 specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 7/0008 providing for indirect lighting
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/09054 Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

An assembly for use in a solid state directional lamp is disclosed. The assembly includes a multilayer FR4 printed circuit board and a metal heat spreader assembled with the multilayer FR4 printed circuit board. The assembly is configured to mount a plurality of solid state light emitters. The multilayer FR4 printed circuit board defines an aperture and a least a portion of the metal heat spreader is positioned in the aperture of the multilayer FR4 printed circuit board. The portion of the heat spreader positioned in the aperture of the multilayer FR4 printed circuit board is in communication with heat dissipation means.

Claims

1. A lamp comprising:

a printed circuit board;

a metal heat spreader assembled with the printed circuit board; and

a solid state light emitter positioned on the assembled printed circuit board and metal heat spreader, wherein the metal heat spreader is configured to conduct heat generated by the solid state light emitter when energized.

2. The lamp of claim 1, wherein the printed circuit board is not thermally conductive.

3. The lamp of claim 2, wherein the printed circuit board is a multilayer FR4 printed circuit board.

4. The lamp of claim 1, wherein the metal heat spreader contacts a back side of the solid state light emitter.

5. The lamp of claim 1, wherein the printed circuit board defines an aperture and at least a portion of the metal heat spreader is positioned in the aperture of the printed circuit board.

6. The lamp of claim 5, wherein the portion of the metal heat spreader positioned in the aperture of the printed circuit board is in communication with heat dissipation means.

7. The lamp of claim 6, wherein the portion of the metal heat spreader positioned in the aperture of the printed circuit board is in communication with a heat pipe.

8. The lamp of claim 6, wherein the portion of the metal heat spreader positioned in the aperture of the printed circuit board is a solid core of metal.

9. The lamp of claim 5, further comprising:

a housing defining an air passageway passing through the housing, wherein the air passageway is in communication with the portion of the metal heat spreader positioned in the aperture of the printed circuit board, and wherein the air passageway is configured to providing cooling to the lamp when the solid state light emitter is energized.

10. The lamp of claim 9, wherein the portion of the metal heat spreader positioned in the aperture of the printed circuit board defines one or more fins configured to act as heat sinks.

11. The lamp of claim 1, wherein the solid state light emitter is a single color LED.

12. The lamp of claim 1, wherein the solid state light emitter is a multicolored LED.

13. The lamp of claim 12, wherein the solid state light emitter is a BSY +Red LED.

14. An assembly for use in a lamp, comprising:

a main printed circuit board;

a metal heat spreader assembled with the main printed circuit board;

wherein the assembled main printed circuit board and metal heat spreader are configured to mount a solid state light emitter;

wherein the metal heat spreader is configured to conduct heat generated by the solid state light emitter when energized; and

wherein the metal heat spreader is in communication with heat dissipation means.

15. The assembly of claim 14, wherein the main printed circuit board defines an aperture and at least a portion of the metal heat spreader is positioned in the aperture of the main printed circuit board;

and

wherein the portion of the metal heat spreader positioned in the aperture of the main printed circuit board is in communication with the heat dissipation means.

16. The assembly of claim 15, wherein the portion of the metal heat spreader positioned in the aperture of the main printed circuit board is in communication with a heat pipe.

17. The assembly of claim 15, where the portion of the metal heat spreader positioned in the aperture of the main printed circuit board is a solid core of metal.

18. The assembly of claim 15, wherein the portion of the metal heat spreader positioned in the aperture of the main printed circuit board is configured to be in communication with an air passageway of a housing when the assembly is positioned in the lamp.

19. The assembly of claim 14, wherein the metal heat spreader contacts a back side of the solid state light emitter mounted to assembly.

20. The lamp of claim 14, wherein the main printed circuit board is not thermally conductive.

21. The lamp of claim 20, wherein the main printed circuit board is a multilayer FR4 printed circuit board.

22. The assembly of claim 14, further comprising:

a printed circuit board extension electrically connected to the main printed circuit board;

wherein electronics for driving the solid state light emitter are mounted on the printed circuit board extension.

23. The assembly of claim 22, wherien the printed circuit board extension is positioned in the assembly substantially perpendicular to the main printed circuit board.

24. The assembly of claim 14, wherein the metal heat spreader defines a collar configured to be positioned in an air passageway of a housing when the assembly is positioned in the lamp.