SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
First Claim
1. A semiconductor device comprising:
- a first substrate having flexibility;
a first insulating layer over the first substrate;
an oxide semiconductor layer over the first insulating layer, wherein the oxide semiconductor layer comprises a crystal region which is c-axis-aligned perpendicularly to a surface of the oxide semiconductor layer,a second insulating layer over the oxide semiconductor layer;
wherein the second insulating layer extends in a channel width direction of the oxide semiconductor layer from a first position to a second position so as to intersect with the oxide semiconductor layer, wherein the first insulating layer and the second insulating layer are in contact with each other in the first position and in the second position.
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Abstract
A more convenient and highly reliable semiconductor device which has a transistor including an oxide semiconductor with higher impact resistance used for a variety of applications is provided. A semiconductor device has a bottom-gate transistor including a gate electrode layer, a gate insulating layer, and an oxide semiconductor layer over a substrate, an insulating layer over the transistor, and a conductive layer over the insulating layer. The insulating layer covers the oxide semiconductor layer and is in contact with the gate insulating layer. In a channel width direction of the oxide semiconductor layer, end portions of the gate insulating layer and the insulating layer are aligned with each other over the gate electrode layer, and the conductive layer covers a channel formation region of the oxide semiconductor layer and the end portions of the gate insulating layer and the insulating layer and is in contact with the gate electrode layer.
17 Citations
20 Claims
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1. A semiconductor device comprising:
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a first substrate having flexibility; a first insulating layer over the first substrate; an oxide semiconductor layer over the first insulating layer, wherein the oxide semiconductor layer comprises a crystal region which is c-axis-aligned perpendicularly to a surface of the oxide semiconductor layer, a second insulating layer over the oxide semiconductor layer; wherein the second insulating layer extends in a channel width direction of the oxide semiconductor layer from a first position to a second position so as to intersect with the oxide semiconductor layer, wherein the first insulating layer and the second insulating layer are in contact with each other in the first position and in the second position. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor device comprising:
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a first substrate having flexibility; a first conductive layer over the first substrate; a first insulating layer over the first conductive layer; an oxide semiconductor layer over the first insulating layer, wherein the oxide semiconductor layer comprises a crystal region which is c-axis-aligned perpendicularly to a surface of the oxide semiconductor layer, a second insulating layer over the oxide semiconductor layer; a second conductive layer over the second insulating layer; wherein the second insulating layer extends in a channel width direction of the oxide semiconductor layer from a first position to a second position so as to intersect with the oxide semiconductor layer, wherein the first insulating layer and the second insulating layer are in contact with each other in the first position and in the second position, and wherein the second conductive layer extends in the channel width direction from a third position to a fourth position so as to intersect with the oxide semiconductor layer, wherein the first conductive layer and the second conductive layer are in contact with each other in the third position and in the fourth position. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A semiconductor device comprising:
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a first substrate having flexibility; a first conductive layer over the first substrate; a first insulating layer over the first conductive layer; a first oxide semiconductor layer over the first insulating layer, wherein the first oxide semiconductor layer comprises a crystal region which is c-axis-aligned perpendicularly to a surface of the first oxide semiconductor layer, a second insulating layer over the first oxide semiconductor layer; a third insulating layer over the first conductive layer; a second oxide semiconductor layer over the third insulating layer, wherein the second oxide semiconductor layer comprises a crystal region which is c-axis-aligned perpendicularly to a surface of the second oxide semiconductor layer; a fourth insulating layer over the second oxide semiconductor layer; a second conductive layer over the second insulating layer and the fourth insulating layer; wherein the second insulating layer extends in a channel width direction of the first oxide semiconductor layer from a first position to a second position so as to intersect with the first oxide semiconductor layer, wherein the first insulating layer and the second insulating layer are in contact with each other in the first position and in the second position, wherein the fourth insulating layer extends in a channel width direction of the second oxide semiconductor layer from a third position to a fourth position so as to intersect with the second oxide semiconductor layer, wherein the third insulating layer and the fourth insulating layer are in contact with each other in the third position and in the fourth position, wherein the second conductive layer extends in the channel width direction of the first oxide semiconductor layer from a fifth position to a sixth position so as to intersect with the first oxide semiconductor layer, wherein the first conductive layer and the second conductive layer are in contact with each other in the fifth position and in the sixth position, and wherein the second conductive layer extends in the channel width direction of the second oxide semiconductor layer from the sixth position to a seventh position so as to intersect with the second oxide semiconductor layer, wherein the first conductive layer and the second conductive layer are in contact with each other in the seventh position. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification