HERMETICALLY SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT WITH VERTICALLY INTEGRATED ELECTRONICS

• US 20130001550A1
• Filed: 06/28/2012
• Published: 01/03/2013
• Est. Priority Date: 06/29/2011
• Status: Abandoned Application

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: SEEGER, Joseph, TCHERTKOV, Igor, YARALIOGLU, Goksen G., NASIRI, Steven S., AKYOL, Hasan, GURIN, Ilya
• Application Number:
  US13/536,798
• Publication Number:
  US 20130001550A1
• Time in Patent Office: Days
• US Class Current: 257/48
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2207/015 the micromechanical device and the control or processing electronics being integrated on the same substrate
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: B81C 2203/0771 Stacking the electronic processing unit and the micromechanical structure
• CPC Class Codes: B81C 99/0045 End test of the packaged device
• CPC Class Codes: G01L 1/142 using capacitors
• CPC Class Codes: G01L 19/0636 using particle filters
• CPC Class Codes: G01L 27/007 Malfunction diagnosis, i.e. diagnosing a sensor defect
• CPC Class Codes: G01L 5/223 to joystick controls
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/084 the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Abstract

A system and method for providing a MEMS device with integrated electronics are disclosed. The MEMS device comprises an integrated circuit substrate and a MEMS subassembly coupled to the integrated circuit substrate. The integrated circuit substrate includes at least one circuit coupled to at least one fixed electrode. The MEMS subassembly includes at least one standoff formed by a lithographic process, a flexible plate with a top surface and a bottom surface, and a MEMS electrode coupled to the flexible plate and electrically coupled to the at least one standoff. A force acting on the flexible plate causes a change in a gap between the MEMS electrode and the at least one fixed electrode.

Claims

1. A Microelectromechanical Systems (MEMS) device with integrated electronics,

the MEMS device comprising:

an integrated circuit substrate, wherein the integrated circuit substrate includes at least one circuit coupled to at least one fixed electrode; and

a MEMS subassembly coupled to the integrated circuit substrate,

wherein the MEMS subassembly includes at least one standoff formed by a lithographic process, a flexible plate with a top surface and a bottom surface,

and a MEMS electrode coupled to the flexible plate and electrically coupled to the at least one standoff,

wherein a force acting on the flexible plate causes a change in a gap between the MEMS electrode and the at least one fixed electrode.

2. The MEMS device of claim 1, wherein the at least one standoff defines the gap between the MEMS electrode and the at least one fixed electrode, wherein the at least one standoff is bonded with a conductive bond to the integrated circuit substrate to form a sealed cavity and to form an electrical connection between the MEMS electrode and the integrated circuit substrate.

3. The MEMS device of claim 2, wherein at least one portion of the bottom surface of the flexible plate is a surface of the sealed cavity and at least one portion of the top surface of the flexible plate is exposed to an ambient environment.

4. The MEMS device of claim 3, wherein the MEMS subassembly further includes:

a device layer bonded to a handle substrate, wherein the at least one standoff and the flexible plate are formed on the device layer, wherein an opening in the handle substrate exposes the at least one portion of the top surface of the flexible plate to the ambient environment.

5. The MEMS device of claim 2, wherein the force results from a difference between ambient pressure and pressure in the sealed cavity.

6. The MEMS device of claim 5, wherein the pressure in the sealed cavity is chosen such that temperature dependence of a pressure sensor offset is cancelled.

7. The MEMS device of claim 1, wherein the at least one fixed electrode is a first and a second fixed electrode disposed on the integrated circuit substrate, wherein the first fixed electrode is near a moving portion of the MEMS electrode and the second fixed electrode is near a reference portion of the MEMS electrode, wherein the reference portion responds to force differently than the moving portion.

8. The MEMS device of claim 7, further comprising:

a first capacitor formed between the first fixed electrode and the moving portion; and

a second capacitor formed between the second fixed electrode and the reference portion, wherein a capacitance difference is measured between the first and the second capacitors to sense force and reject gap variation.

9. The MEMS device of claim 7, further comprising:

a third and a fourth capacitor formed on the integrated circuit substrate, wherein the third capacitor is coupled to the first fixed electrode and the fourth capacitor is coupled to the second fixed electrode, wherein the first, the second, the third, and the fourth capacitors are arranged to form a capacitive bridge configuration.

10. The MEMS device of claim 7, wherein the at least one fixed electrode is at least one self-test electrode, wherein an electrostatic force is created by applying an electric potential difference between the at least one self-test electrode and the MEMS electrode, whereby the electrostatic force acts on the flexible plate to cause a deflection of the flexible plate.

11. The MEMS device of claim 10, wherein the electrostatic force is substantially parallel to the flexible plate causing tilt of the flexible plate measured by the first and the second electrodes.

12. The MEMS device of claim 1, further comprising:

an additional mass coupled to the flexible plate and at least three fixed electrodes to measure motion normal to the integrated circuit substrate and motion in a first direction parallel to the integrated circuit substrate and motion in a second direction parallel to the integrated circuit substrate and orthogonal to the first direction.

13. The MEMS device of claim 1, further comprising:

a flow channel coupled to the top surface of the flexible plate, wherein force acting on the flexible plate is of fluid-structure interaction nature.

14. The MEMS device of claim 4, wherein the handle substrate includes a particle filter.

15. The MEMS device of claim 1, further comprising:

a second flexible plate with a top surface and a bottom surface, wherein at least one portion of the bottom surface of the a second flexible plate is a surface of a second sealed cavity and at least one portion of the top surface of the second flexible plate is exposed to the ambient environment, wherein at least one portion of the second flexible plate serves as a reference electrode and is coupled to at least another standoff; and

a second MEMS electrode coupled to the second flexible plate, wherein the second MEMS electrode is electrically coupled to the at least another standoff, wherein the second MEMS electrode is near a second fixed electrode disposed on the integrated circuit substrate.

16. The MEMS device of claim 1, further comprising:

a chemical compound coating coupled to the top surface of the flexible plate, wherein the chemical compound coating enables micro-balanced chemical sensing.

17. The MEMS device of claim 1, further comprising:

a self-testing electrode coupled to the integrated circuit substrate; and

a charge pump coupled to the integrated circuit substrate, wherein the charge pump is activated to self-test and self-calibrate the MEMS device.

18. A method for providing a Microelectromechanical Systems (MEMS) device with integrated electronics, the method comprising:

providing an integrated circuit substrate, wherein the integrated circuit substrate includes at least one circuit coupled to at least one fixed electrode; and

coupling a MEMS subassembly to the integrated circuit substrate, wherein the MEMS subassembly includes at least one standoff formed by a lithographic process, a flexible plate with a top surface and a bottom surface, and a MEMS electrode coupled to the flexible plate and electrically coupled to the at least one standoff, wherein a force acting on the flexible plate causes a change in a gap between the MEMS electrode and the at least one fixed electrode.

19. The method of claim 18, further comprising:

applying an electric potential difference between at least one self-test electrode of an integrated circuit substrate and a MEMS electrode coupled to the flexible plate to create an electrostatic force, whereby the electrostatic force acts on the flexible plate causing the deflection to self-test and self-calibrate the MEMS device.

20. The method of claim 18, further comprising:

coupling a particle filter to the flexible plate, wherein the particle filter enhances environmental protection of the MEMS device.