SUB-MOUNT, LIGHT EMITTING DEVICE INCLUDING SUB-MOUNT AND METHODS OF MANUFACTURING SUCH SUB-MOUNT AND/OR LIGHT EMITTING DEVICE

• US 20130001606A1
• Filed: 08/03/2012
• Published: 01/03/2013
• Est. Priority Date: 06/24/2008
• Status: Active Grant

• Current Assignee: Woo-Sung Han, Yu-Sik Kim
• Original Assignee: Woo-Sung Han, Yu-Sik Kim
• Inventors: KIM, Yu-Sik, HAN, Woo-Sung
• Granted Patent: US 9,119,304 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H05K 1/0295 adapted for choosing between different types or different locations of mounted components
• CPC Class Codes: H05K 2201/09227 Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
• CPC Class Codes: H05K 2201/09254 Branched layout
• CPC Class Codes: H05K 2201/09318 Core having one signal plane and one power plane
• CPC Class Codes: H05K 2201/0949 Pad close to a hole, not surrounding the hole if used for surface mounting H05K1/114
• CPC Class Codes: H05K 2201/09663 Divided layout, i.e. conductors divided in two or more parts branched layout H05K2201/09254
• CPC Class Codes: H05K 2201/09954 More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/173 Adding connections between adjacent pads or conductors, e.g. for modifying or repairing programmable, customizable or modifiable circuits H05K1/0286

Abstract

A sub-mount adapted for AC and DC operation of devices mountable thereon, light emitting devices including such a sub-mount, and methods of manufacturing such a sub-mount are provided. The sub-mount includes a base substrate having first and second surfaces, a conductive pattern on the first surface, first and second pairs of first and second electrodes on the second surface and vias extending through the base substrate between the first and second surfaces. The conductive pattern includes a first set of mounting portions and two via portions along a first electrical path between the first pair of first and second electrodes, and a second set of mounting portions and two via portions along a second electrical path between the second pair of first and second electrodes, the via portions connecting respective portions of the conductive pattern to respective electrodes.

Claims

1. A sub-mount adapted for AC and DC operation of devices mountable thereon, the sub-mount comprising:

a base substrate including a first surface and a second surface, the first surface being different from the second surface;

a conductive pattern on the first surface;

a first pair of first and second electrodes on the second surface of the base substrate;

a second pair of first and second electrodes on the second surface of the base substrate; and

a plurality of vias extending through the base substrate between the first surface and the second surface,

wherein;

the conductive pattern includes a first set of mounting portions and two via portions along a first electrical path between the first pair of first and second electrodes, and a second set of mounting portions and two via portions along a second electrical path between the second pair of first and second electrodes, the first path being independent of the second path, and

each of the via portions connecting respective portions of the conductive pattern to a respective one of the electrodes of the first and second pair of first and second electrodes through a respective one of the vias.

2. The sub-mount as claimed in claim 1, wherein the conductive pattern further includes wiring portions adapted to connect respective mounting portions together.

3. The sub-mount as claimed in claim 1, wherein each of the mounting portions includes a mounting sub-portion and a connecting sub-portion.

5. The sub-mount as claimed in claim 3, wherein each of the mounting sub-portions corresponds to a mounting region of the sub-mount, each of the mounting regions being adapted to mount a light emitting device thereon.

6. The sub-mount as claimed in claim 5, wherein each of the connecting sub-portions is associated with two of the mounting regions.

7. The sub-mount as claimed in claim 5, wherein the mounting sub-portions are arranged in a matrix pattern.

9. The sub-mount as claimed in claim 1, wherein:

the first electrical path flows from one of the first and second electrodes of the first pair of electrodes through the a first via of the plurality of vias, a first via portion of the corresponding two via portions, the first set the mounting portions, a second via portion of the corresponding two via portions, a second via of the plurality of vias, and the other of the first and second electrodes of the first pair of electrodes, and

the second electrical path flows from one of the first and second electrodes of the second pair of electrodes through a third via of the plurality of vias, a via portion of the corresponding two via portions, the second set of mounting portions, a second via portion of the corresponding two via portions, a fourth via of the plurality of vias, and the other of the first and second electrodes of the second pair of electrodes.

10. The sub-mount as claimed in claim 1, wherein the first and second pair of first and second electrodes are arranged in a matrix pattern on the second surface, and the first pair of first and second electrodes are arranged diagonally along a first direction and the second pair of first electrodes are arranged diagonally along a second direction.

11. The sub-mount as claimed in claim 1, wherein each of the mounting portions includes three mounting sub-portions arranged adjacent to each other, each of the mounting sub-portions being spaced apart from each other.

14. The sub-mount as claimed in claim 1, wherein the mounting portions are arranged in a matrix pattern.

4. (canceled)

8. (canceled)

12. (canceled)

13. (canceled)

15. A light emitting device, comprising:

at least one sub-mount including a base substrate, a first pair of first and second electrodes, a second pair of first and second electrodes, a conductive pattern, and a plurality of vias;

a first set of light emitting devices mounted on the sub-mount, the first set of light emitting devices being connected between the first pair of first and second electrodes of the sub-mount; and

a second set of light emitting devices mounted on the sub-mount, the second set of light emitting devices being connected between the second pair of first and second electrodes of the sub-mount;

a first power supply electrode connected to one of the first and second electrodes of the first pair of electrodes and one of the first and second electrodes of the second pair of electrodes on the sub-mount; and

a second power supply electrode connected to the other of the first and second electrodes of the first pair of electrodes and the other of the first and second electrodes of the second pair of electrodes on the sub-mount;

wherein the sub-mount is adapted for AC and DC operation of the light emitting devices based on which one of the first and second electrodes of each pair of electrodes is connected to the to the first power supply electrode and the second power supply electrode.

16. The light emitting device as claimed in claim 15, wherein the light emitting devices of each of the first and second sets of light emitting devices are arranged in series and/or in parallel with each other.

17. The light emitting device as claimed in claim 15, wherein the first and second sets of light emitting devices are mounted on the sub-mounts in a matrix pattern.

18. The light emitting device as claimed in claim 17, further comprising:

a plurality of the sub-mounts; and

a circuit substrate including a plurality of connecting patterns, the first power supply electrode and the second power supply electrode arranged thereon, the connecting patterns being adapted to electrically connect a plurality of the sub-mounts along an electrical path between the first power supply electrode and the second power supply electrode.

19. The light emitting device as claimed in claim 15, further comprising a substrate on which the first power supply electrode and the second power supply electrode are arranged, wherein a plurality of the sub-mounts are arranged on the substrate such that, for each of the sub-mounts, one of the first and second electrodes of the first electrode pair is connected to the first power supply electrode and the other of the first and second electrodes of the second electrode pair is connected to the second power supply electrode, and one of the first and second electrodes of the second electrode pair is connected to the second power supply electrode and the other of the first and second electrodes of the second electrode pair is connected to the second power supply electrode.

20. The light emitting device as claimed in claim 19, wherein the first power supply electrode and the second power supply electrode extend parallel to each other on the substrate.

21. The light emitting device as claimed in claim 15, wherein each of the light emitting devices of the first set and the second set of light emitting devices is a light emitting diode.

22. A sub-mount employable for electrically connecting a plurality of light emitting devices in series and/or in parallel on a mounting substrate, the sub-mount including:

a base substrate;

a conductive pattern on the base substrate;

a first pair of first and second electrodes on the base substrate;

a second pair of first and second electrodes on the base substrate; and

a plurality of vias extending through the base substrate,

wherein;

the conductive pattern includes a first set of mounting portions defining a first electrical path between the first pair of first and second electrodes through first and second ones of the plurality of vias, and a second set of mounting portions defining a second electrical path between the second pair of first and second electrodes through third and fourth ones of the plurality of vias, the first path being independent of the second path,

when the sub-mount is arranged in a first orientation on the mounting substrate, the plurality of light emitting devices mountable on the first set of mounting portions and the plurality of light emitting devices mountable on the second set of mounting portions thereon are electrically connected such that current flows through the first set of light emitting devices and the second set of light emitting devices in a forward bias direction, and

when the sub-mount is arranged in a second orientation on the mounting substrate, the plurality of light emitting devices mountable on the first set of mounting portions and the plurality of light emitting devices mountable on the second set of mounting portions thereon are electrically connected such that current flows through the first set of light emitting devices in a forward bias direction and current flows through the second set of light emitting devices in a reverse bias direction, the first orientation being different from the second orientation.

23. The sub-mount as claimed in claim 22, wherein the first orientation is rotated 90 degrees relative to the second orientation.

24. A method of manufacturing a sub-mount adapted for AC and DC operation of devices mountable thereon, the method comprising:

forming a plurality of vias in a base substrate;

forming a conductive pattern on a first surface of the base substrate;

forming a first pair of first and second electrodes on a second surface of the base substrate;

forming a second pair of first and second electrodes on the second surface of the base substrate, wherein;

the vias extend through the base substrate between the first surface and the second surface,

the conductive pattern includes a first set of mounting portions and two via portions along a first electrical path between the first pair of first and second electrodes, and a second set of mounting portions and two via portions along a second electrical path between the second pair of first and second electrodes, the first path being independent of the second path, and

each of the via portions connecting respective portions of the conductive pattern to a respective one of the electrodes of the first and second pair of first and second electrodes through a respective one of the vias.