PACKAGE AND METHOD FOR MANUFACTURING PACKAGE

• US 20130001767A1
• Filed: 06/27/2012
• Published: 01/03/2013
• Est. Priority Date: 06/28/2011
• Status: Abandoned Application

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: KAJIKI, Atsunori
• Application Number:
  US13/534,409
• Publication Number:
  US 20130001767A1
• Time in Patent Office: Days
• US Class Current: 257/734
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/1076 Shape of the containers
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15331 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1815 Shape

Abstract

A method for manufacturing a package, includes preparing a substrate having a first surface on which a connecting pad is formed, mounting a sacrificing material on the connecting pad, forming a package portion covering the first surface of the substrate, exposing the sacrificing material from a surface of the package portion, and removing the exposed sacrificing material from the side of the surface of the package portion, and forming an opening portion in the package portion on the connecting pad.

Claims

1. A method for manufacturing a package, comprising:

preparing a substrate having a first surface on which a connecting pad is formed;

mounting a sacrificing material on the connecting pad;

forming a package portion covering the first surface of the substrate;

exposing the sacrificing material from a surface of the package portion; and

removing the exposed sacrificing material from surface of the package portion, and forming an opening portion in the package portion on the connecting pad.

2. The package manufacturing method according to claim 1, wherein:

the sacrificing material has high etching selectivity against the package portion, and

the sacrificing material is removed using etchant having the etching selectivity when the sacrificing material is removed so that the opening portion has a shape corresponding to a shape of the sacrificing material.

3. The package manufacturing method according to claim 1, wherein:

the sacrificing material has a spherical shape,

half or more the sacrificing material is removed and exposed by grinding from the surface of the package portion, and

the opening portion is shaped into a bowl having a curved inner wall surface when the sacrificing material is removed.

4. The package manufacturing method according to claim 1, further comprising:

after removing the sacrificing material, performing reflowing to melt a part of the sacrificing material and to form a solder on the connecting pad,

wherein;

the sacrificing material is configured by a solder, and

the sacrificing material is removed to make a part of the sacrificing material remain.

5. The package manufacturing method according to claim 1, wherein the package portion is configured by a mold resin.

6. A package comprising:

a substrate having a first surface on which a connecting pad is formed; and

a package portion being configured by a resin and covering the first surface of the substrate,

wherein the package portion has an opening portion communicating with the connecting pad, and

the opening portion is shaped into a bowl having a curved inner wall surface.

7. The package according to claim 6, further comprising:

an electronic component mounted on the first surface of the substrate,

wherein the package encloses the electronic component,

an edge part of each of the opening portions adjoining with one another around the electronic component is shared, and

a height from the substrate to a surface of a top portion of the edge part is equal to a height from the substrate to the surface of the package portion through the electronic component.

8. The package according to claim 6, further comprising:

a bonding material formed on a bottom portion of the opening portion and on the connecting pad.

9. The package according to claim 6, wherein the package portion is configured by a mold resin.