ELECTRONIC CONTROL UNIT AND METHOD OF MANUFACTURING THE SAME

• US 20130003306A1
• Filed: 09/12/2012
• Published: 01/03/2013
• Est. Priority Date: 04/02/2009
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Oota, Shinsuke, Saitou, Mitsuhiro, Oohashi, Yutaka
• Granted Patent: US 9,320,178 B2
• Time in Patent Office: Days
• US Class Current: 361/709
• CPC Class Codes: B60R 16/0239 Electronic boxes
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 2201/0187 with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
• CPC Class Codes: H05K 2201/09054 Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/42 Plated through-holes or plated via connections
• CPC Class Codes: H05K 5/0082 specially adapted for transmission control units, e.g. gearbox controllers
• CPC Class Codes: H05K 7/20854 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20863 takes precedence
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.

Claims

1. An electronic control unit comprising:

a resin board;

a power device that is surface-mounted on the resin board;

a microcomputer that is configured to control the power device;

a heat sink for radiating heat, the heat sink being disposed on an opposite side of the resin board from the power device;

an insulating heat-radiation sheet for conducting the heat generated by the power device to the heat sink, the insulating heat-radiation sheet being placed between the resin board and the heat sink;

a first fixation member that fixes the heat sink and a corner part of the resin board; and

a second fixation member that fixes the heat sink and a center part of the resin board,

wherein the insulating heat-radiation sheet is positioned by the first fixation member and the second fixation member.

2. The electronic control unit according to claim 1, wherein:

the insulating heat-radiation sheet has a first notch at a position corresponding to the first fixation member and a second notch at a position corresponding to the second fixation member.

3. The electronic control unit according to claim 1, wherein:

the heat sink has

a projection part projecting toward the resin board and

a base part extending generally parallel to the resin board.

4. The electronic control unit according to claim 3, wherein:

the power device is a plurality of power devices; and

all the plurality of power devices is disposed on a portion of the resin board between the first fixation member and the second fixation member, wherein the portion of the resin board between the first fixation member and the second fixation member is disposed to correspond to the projection part of the heat sink.

5. The electronic control unit according to claim 4, further comprising:

a heat radiation grease for conducting the heat generated by the power device to the heat sink, the heat radiation grease being disposed between the insulating heat-radiation sheet and the resin board,

wherein;

the heat radiation grease fills an inside of a through-hole via of the resin board.

6. The electronic control unit according to claim 1, further comprising:

a cover constructed to protect the power device;

wherein;

the cover, the resin board and the heat sink are tighten together by using the first and second fixation members.