ARTICLE WITH METAL GRID COMPOSITE AND METHODS OF PREPARING
First Claim
1. An article comprising an article substrate, having thereon, in order, an adhesive layer and a reverse composite comprising an electronically conductive polymer layer and a metal grid such that the metal grid is disposed over the adhesive layer and the voids of the metal grid are filled by the electronically conductive polymer, and at least some of the metal grid is uncovered.
14 Assignments
0 Petitions
Accused Products
Abstract
A laminate donor element can be used to transfer a composite of a metal grid and an electronically conductive polymer to a receiver sheet for use in various devices. The laminate donor element has a donor substrate, a metal grid that is disposed over only portions of the donor substrate, leaving portions of the substrate uncovered by the metal grid, and an electronically conductive polymer that covers the portions of the donor substrate that are uncovered by the metal grid. The composite of metal grid and electronically conductive polymer exhibits a peel force of less than or equal to 40 g/cm for separation from the donor substrate at room temperature. The resulting article has a substrate on which a reverse composite of the metal grid and electronically conductive polymer is disposed, which article can be incorporated into various devices.
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Citations
22 Claims
- 1. An article comprising an article substrate, having thereon, in order, an adhesive layer and a reverse composite comprising an electronically conductive polymer layer and a metal grid such that the metal grid is disposed over the adhesive layer and the voids of the metal grid are filled by the electronically conductive polymer, and at least some of the metal grid is uncovered.
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8. A method of forming an article comprising a metal grid, the method comprising:
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under beat, pressure, or both heat and pressure, forming as assembly of a laminate donor element and a receiver sheet, the laminate donor element comprising, in order; a donor substrate, a metal grid comprising two or more metal lines that are in direct contact with only portions of the donor substrate, leaving portions of the donor substrate uncovered by the metal grid, and an electronically conductive polymer layer that directly covers the portions of the donor substrate uncovered by the metal grid, and optionally directly covers at least some of the metal grid, thereby forming a composite of metal grid and electronically conductive polymer, and transferring the composite of metal grid and electronically conductive polymer from the donor substrate to the receiver sheet so that the receiver sheet has thereon a reverse composite comprising the electronically conductive polymer layer and the metal grid such that the metal grid is disposed on the receiver sheet and the voids of the metal grid are filled by the electronically conductive polymer, and at least some of the metal grid is uncovered. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. An assembly comprising a laminate donor element in intimate contact with a receiver sheet comprising a receiver substrate,
the laminate donor element comprising, in order: -
a donor substrate, a metal grid comprising two or more metal lines that are in direct contact with only portions of the donor substrate, leaving portions of the donor substrate uncovered by the metal grid, and an electronically conductive polymer layer that directly covers the portions of the donor substrate uncovered by the metal grid, and optionally directly covers at least some of the metal grid, thereby forming a composite of metal grid and electronically conductive polymer. - View Dependent Claims (17, 18, 19, 20, 21)
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22. An article comprising an article substrate having thereon a continuous electronically conductive polymer and a metal grid disposed within the outer surface of the continuous electronically conductive polymer layer such that the voids of the metal grid are filled by the continuous electronically conductive polymer, and wherein the electronically conductive polymer is also disposed between the substrate and the metal grid.
Specification