PLANAR PATTERNED TRANSPARENT CONTACT, DEVICES WITH PLANAR PATTERNED TRANSPARENT CONTACTS, AND/OR METHODS OF MAKING THE SAME

• US 20130005135A1
• Filed: 06/30/2011
• Published: 01/03/2013
• Est. Priority Date: 06/30/2011
• Status: Abandoned Application

• Current Assignee: Guardian Glass LLC (KOCH Industries Incorporated)
• Original Assignee: Guardian Industries Corporation (KOCH Industries Incorporated)
• Inventors: Krasnov, Alexey, Imran, Muhammad, den Boer, Willem
• Application Number:
  US13/174,349
• Publication Number:
  US 20130005135A1
• Time in Patent Office: Days
• US Class Current: 438/609
• CPC Class Codes: C03C 17/3423 at least one of the coatings comprising a suboxide
• CPC Class Codes: C03C 2218/324 De-oxidation
• CPC Class Codes: C03C 2218/34 Masking
• CPC Class Codes: G02F 1/13439 characterised by their electrical, optical, physical properties; materials therefor; method of making
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/044 by capacitive means
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
• CPC Class Codes: H01L 2933/0016 relating to electrodes
• CPC Class Codes: H01L 31/022466 made of transparent conductive layers, e.g. TCO, ITO layers
• CPC Class Codes: H01L 31/022475 composed of indium tin oxide [ITO]
• CPC Class Codes: H01L 31/1884 Manufacture of transparent electrodes, e.g. TCO, ITO
• CPC Class Codes: H10K 30/82 Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
• CPC Class Codes: H10K 50/816 Multilayers, e.g. transparent multilayers
• CPC Class Codes: H10K 50/826 Multilayers, e.g. opaque multilayers
• CPC Class Codes: H10K 59/80517 Multilayers, e.g. transparent multilayers
• CPC Class Codes: H10K 59/80523 Multilayers, e.g. opaque multilayers
• CPC Class Codes: Y02E 10/549 Organic PV cells

Abstract

Certain examples relate to improved methods for making patterned substantially transparent contact films, and contact films made by such methods. In certain cases, the contact films may be patterned and substantially planar. Thus, the contact films may be patterned without intentionally removing any material from the layers and/or film, such as may be required by photolithography. In certain example embodiments, an oxygen exchanging system comprising at least two layers may be deposited on a substrate, and the layers may be selectively exposed to heat and/or energy to facilitate the transfer of oxygen ions or atoms from the layer with a higher enthalpy of formation to a layer with a lower enthalpy of formation. In certain cases, the oxygen transfer may permit the conductivity of selective portions of the film to be changed. This advantageously may result in a planar contact film that is patterned with respect to conductivity and/or resistivity.

Claims

1. A method of making a coated article comprising a multi-layer thin-film coating supported by a substrate, the method comprising:

disposing a first layer comprising Ag and O on the substrate;

disposing a sub-oxidized buffer layer on the first layer; and

selectively applying energy to one or more portions of the first layer so as to cause oxygen at the one more portions therein to migrate upward into the sub-oxidized buffer layer to increase conductivity of the first layer at the one or more portions,

wherein after the selective application of energy, the multi-layer thin-film coating is substantially planar and patterned with respect to conductivity and/or resistivity.

2. The method of claim 1, wherein the first layer has an enthalpy of formation that is higher than an enthalpy of formation of the sub-oxidized buffer layer.

3. The method of claim 2, wherein the sub-oxidized buffer layer comprises sub-oxidized ZrOx, metallic Zr, ZrTiOx, ZrAlOx, ITO, or ZrNbOx.

4. The method of claim 3, further comprising disposing a seed layer on the glass substrate, the first layer being over and directly contacting the seed layer.

5. The method of claim 4, wherein the seed layer comprises zinc oxide.

6. The method of claim 5, further comprising disposing an overcoat layer comprising TiOx, SiOx, SixNy, or SiOxNy over the sub-oxidized buffer layer.

7. The method of claim 1, wherein following the selective application of energy, the resistivity of the first layer at the one or more portions is reduced to less than 50 ohms/square and wherein the resistivity of the first layer outside the one or more portions is at least about 1 Mohm/square.

8. The method of claim 1, wherein following the selective application of energy, a sheet resistance ratio of resistivity at areas outside the one or more portions of the first layer to areas at the one or more portions of the first layer is at least about 30,000:

1.

9. The method of claim 1, wherein following the selective application of energy, a sheet resistance ratio of resistivity at areas outside the one or more portions of the first layer to areas at the one or more portions of the first layer is at least about 100,000:

1.

10. The method of claim 1, wherein the selective application of energy causes an a* and b* shift of less than 5.

11. The method of claim 1, wherein the selective application of energy causes an a* and b* shift of less than 3.

12. The method of claim 1, wherein the selective application of energy is performed using a short-wave infrared energy source.

13. The method of claim 1, wherein the selective application of energy is performed using a near-infrared energy source.

14. The method of claim 1, wherein the selective application of energy is performed using a YAG laser.

15. The method of claim 1, wherein the selective application of energy is performed through a heat-blocking mask interposed between a source of the energy and the coated article.

16. The method of claim 1, further comprising:

disposing a layer comprising tin oxide on the substrate; and

disposing a layer comprising zinc oxide on the layer comprising tin oxide, the layer comprising zinc oxide being below but directly contacting the layer comprising Ag and O.

17. A method of making an electronic device, the method comprising:

providing a coated article including a glass substrate supporting a multi-layer thin-film coating, the multi-layer thin-film coating comprising, moving away from the substrate;

a seed layer comprising Zn,

a layer comprising Ag and O, and

a sub-oxidized buffer layer;

defining a first set of portions in the layer comprising Ag and O that are to be conductive portions and a second set of portions in the layer comprising Ag and O that are to be non-conductive and/or less conductive portions;

exposing the coating, including the layer comprising Ag and O, to energy, from an energy source, in areas over the first set of portions so as to cause migration of oxygen ions or atoms from the layer comprising Ag and O into the sub-oxidized buffer layer and pattern the layer comprising Ag and O with respect to conductivity and/or resistivity; and

building the coated article having the patterned layer comprising Ag into an electronic device.

18. The method of claim 17, wherein the layer comprising Ag comprises AgO, Ag₂O, or AgOx where 0.2≦

x≦

0.8.

19. The method of claim 17, wherein the sub-oxidized buffer layer at least initially comprises sub-oxidized ZrOx, metallic Zr, ZrTiOx, ZrAlOx, ITO, or ZrNbOx at least prior to the exposing.

20. The method of claim 17, wherein the electronic device is a touch panel device, flat panel display device, or solar photovoltaic device.

21. The method of claim 17, wherein the multi-layer thin-film coating varies in thickness by no more than 15% after the exposing.

22. The method of claim 21, wherein optical differences along the multi-layer thin-film coating are imperceptible to a naked human eye.