METHOD FOR MOUNTING ELECTRONIC PARTS

• US 20130008017A1
• Filed: 09/14/2012
• Published: 01/10/2013
• Est. Priority Date: 08/04/2009
• Status: Active Grant

• Current Assignee: Byung-Chul Lee, Gweon-Young Park, Jun-Kyu Park, Sang-Mun Shin
• Original Assignee: Byung-Chul Lee, Gweon-Young Park, Jun-Kyu Park, Sang-Mun Shin
• Inventors: PARK, Jun-Kyu, Shin, Sang-Mun, Park, Gweon-Young, Lee, Byung-Chul
• Granted Patent: US 8,528,197 B2
• Time in Patent Office: Days
• US Class Current: 29/593
• CPC Class Codes: H05K 13/022 with orientation of the elements
• CPC Class Codes: H05K 13/028 Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 Chip component

Abstract

An electronic part mounting method including introducing electronic parts in a bulk form into a bulk feeder, transferring the introduced electronic parts to at least one inspection unit by use of a rotatably installed positioning wheel, inspecting and aligning the electronic parts, transferring the inspected and aligned electronic parts to a part insertion unit by use of the positioning wheel, inserting the electronic parts, determined as good ones by the inspection unit, into the part insertion unit, and picking up the electronic parts received in the part insertion unit to mount the electronic parts on a board.

Claims

1. An electronic part mounting method comprising:

introducing electronic parts in a bulk form into a bulk feeder;

transferring the introduced electronic parts to at least one inspection unit by use of a rotatably installed positioning wheel;

inspecting and aligning the electronic parts;

transferring the inspected and aligned electronic parts to a part insertion unit by use of the positioning wheel;

inserting the electronic parts, determined as good ones by the inspection unit, into the part insertion unit; and

picking up the electronic parts received in the part insertion unit to mount the electronic parts on a board.

2. The electronic part mounting method according to claim 1, wherein the introduction of the electronic parts in a bulk form into the bulk feeder includes:

feeding the electronic parts, classified according to a predetermined standard, into a bowl shaped first feeder; and

feeding the electronic parts fed into the first feeder to a straight second feeder located between an outermost end of the first feeder and the positioning wheel.

3. The electronic part mounting method according to claim 2, further comprising providing the electronic parts with air in order to align the electronic parts fed into the first feeder based on orientation of front and rear surfaces thereof.

4. The electronic part mounting method according to claim 1, wherein the inspection and alignment of the electronic parts include:

determining whether the electronic parts fed from the bulk feeder are defective or good;

discharging the electronic parts determined as defective ones; and

rotating or inverting each electronic part to align polarity of the electronic part.

5. The electronic part mounting method according to claim 4, wherein the inspection and alignment of the electronic parts include determining whether to rotate or invert the electronic part according to whether the electronic part responds to a voltage applied thereto or not, or according to information acquired by comparing image information of the electronic part with image information stored in a database.