METHOD FOR PROCESSING OUTER PERIPHERY OF SUBSTRATE AND APPARATUS THEREOF
First Claim
1. A method for processing the outer peripheral part of a substrate in which an unnecessary matter coated on the outer peripheral part of said substrate is removed by contacting said unnecessary matter with a reactive gas, said method comprising:
- supporting said substrate by a stage so as to be brought a proximal outer peripheral part of said substrate into contact with a support surface of said stage in a manner protruding the outer peripheral part of said substrate from said stage;
locally radiantly heating the protruded outer peripheral part of said substrate with a thermal light;
supplying said reactive gas to the heated outer peripheral part of said substrate; and
heat absorbing the proximal outer peripheral part of said substrate by a heat absorber disposed on said stage.
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Accused Products
Abstract
To make an arrangement so as not to give any damage to the central part of a substrate during the operation for removing unnecessary film coated on the outer peripheral part of the substrate. The stage is provided therein with a refrigerant chamber 41 as a heat absorber and a refrigerant such as water is filled in the chamber. A wafer 90 is contacted with and supported on the support surface 10a of the stage 10. A reactive gas for removing unnecessary film is supplied the outer periphery of the wafer 90 through a reactive gas jet port 30b while heating the outer periphery of the wafer 90. On the other hand, the area inside the outer peripheral part of the wafer 90 is heat-absorbed by the heat absorber.
12 Citations
26 Claims
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1. A method for processing the outer peripheral part of a substrate in which an unnecessary matter coated on the outer peripheral part of said substrate is removed by contacting said unnecessary matter with a reactive gas, said method comprising:
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supporting said substrate by a stage so as to be brought a proximal outer peripheral part of said substrate into contact with a support surface of said stage in a manner protruding the outer peripheral part of said substrate from said stage; locally radiantly heating the protruded outer peripheral part of said substrate with a thermal light; supplying said reactive gas to the heated outer peripheral part of said substrate; and heat absorbing the proximal outer peripheral part of said substrate by a heat absorber disposed on said stage.
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2. An apparatus for processing the outer peripheral part of a substrate in which an unnecessary matter coated on the outer peripheral part of said substrate is removed by contacting said unnecessary matter with a reactive gas, said apparatus comprising:
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(a) a stage including a support surface for supporting said substrate thereon, a diameter of said support surface being smaller than a diameter of the substrate so that a proximal outer peripheral part of said substrate contacts with said support surface in a manner protruding from said support surface in a radial direction; (b) a radiant heater including an irradiator that locally irradiates a thermal light to a target position located radially outwardly from an outer periphery of the stage, wherein the target position is supposed to exist on the protruded outer peripheral part of said substrate supported by said stage; and (c) a reactive gas supplier that supplies said reactive gas to said target position wherein an angle of an axis of the thermal light between the irradiator and the target position with respect to the support surface is not lower than 90 degrees and not greater than 270 degrees. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification