COMPACT OPTICALLY EFFICIENT SOLID STATE LIGHT SOURCE WITH INTEGRATED THERMAL MANAGEMENT
First Claim
1. An LED component, comprising:
- a circuit board having a plurality of die attach pads;
a plurality of LED chips, each of which is mounted on a respective one of the die attach pads; and
primary lenses, each of which is formed directly over a single one or a subgroup of said LED chips.
3 Assignments
0 Petitions
Accused Products
Abstract
A compact and efficient LED array lighting component comprising a circuit board with an array of LED chips mounted on it and electrically interconnected. A plurality of primary lenses is included, each of which is formed directly over each LED chip and/or a sub-group of the LED chips. A heat sink is included with the circuit board mounted to the heat sink so that heat from the LED chips spreads into the heat sink. In some embodiments the circuit board can be thermally conductive and electrically insulating. Method of forming an LED component are also disclosed utilizing chip-on-board mounting techniques for mounting the LED chips on the circuit board, and molding of the primary lenses directly over the LED chips individually or in sub-groups of LED chips.
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Citations
58 Claims
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1. An LED component, comprising:
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a circuit board having a plurality of die attach pads; a plurality of LED chips, each of which is mounted on a respective one of the die attach pads; and primary lenses, each of which is formed directly over a single one or a subgroup of said LED chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. An LED component, comprising:
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a circuit board with an array of LED chips mounted on it and electrically interconnected; a plurality of primary lenses, each of which is formed directly over a single one or a sub-group of said LED chips; a heat sink, said circuit board mounted to said heat sink so that heat from said LED chips spreads into said heat sink. - View Dependent Claims (29, 30, 31, 32, 33, 34)
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35. A solid state lighting component, comprising:
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a circuit board that is thermally conductive and electrically insulating; a plurality of LED chips, each of which is chip-on-board mounted on a respective one of the die attach pads; and a plurality of primary lenses, each of which is formed directly over a single one or a subgroup of said LED chips. - View Dependent Claims (36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47)
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48. A method of forming an LED component, comprising:
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providing a circuit board; chip-on-board mounting LED chips on said circuit board with said LED chips electrically interconnected; and molding primary lenses directly over each of said LED chips and sub-groups of said LED chips. - View Dependent Claims (49, 50, 51)
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52. An LED component, comprising:
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a circuit board; a plurality of LED chips, mounted on said circuit board; a primary optic over a single one or a subgroup of said LED chips; and a secondary optic over said primary optic. - View Dependent Claims (53, 54, 55, 56, 57)
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58. An LED component, comprising:
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a circuit board; a plurality of LED chips, mounted on said circuit board; a plurality of primary optics, each of which is over a single one or a subgroup of said LED chips; and a secondary optic over said primary optics.
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Specification