EVAPORATION MASK, METHOD OF MANUFACTURING EVAPORATION MASK, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

• US 20130015444A1
• Filed: 07/05/2012
• Published: 01/17/2013
• Est. Priority Date: 07/12/2011
• Status: Abandoned Application

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: HIRAI, Nobukazu
• Application Number:
  US13/542,423
• Publication Number:
  US 20130015444A1
• Time in Patent Office: Days
• US Class Current: 257/57
• CPC Class Codes: C23C 14/042 using masks
• CPC Class Codes: C23C 14/044 using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
• CPC Class Codes: H10K 71/166 using selective deposition, e.g. using a mask

Abstract

There are provided an evaporation mask with which an evaporated film is allowed to be formed with a fine pattern, a method of manufacturing the same, and a method of manufacturing an electronic device using such an evaporation mask. Further, there is provided an electronic device having a film-formation pattern that is precisely formed with a fine pattern. The evaporation mask including: a substrate including one or a plurality of first opening sections; and a polymer film provided on a first main surface side of the substrate, the polymer film including one or a plurality of second opening sections communicated with the respective first opening sections.

Claims

1. An evaporation mask comprising:

a substrate including one or a plurality of first opening sections; and

a polymer film provided on a first main surface side of the substrate, the polymer film including one or a plurality of second opening sections communicated with the respective first opening sections.

2. The evaporation mask according to claim 1, wherein a film thickness of the polymer film is smaller than a thickness of the substrate.

3. The evaporation mask according to claim 2, wherein the film thickness of the polymer film is substantially equal to or less than 20 μ

m.

4. The evaporation mask according to claim 3, wherein an opening shape of the second opening section includes a minute shape according to the film thickness of the polymer film.

5. The evaporation mask according to claim 4, wherein

a plurality of the second opening sections are provided,

each opening shape of the plurality of the second opening sections includes a linear shape, and

the plurality of the second opening sections are provided side by side in a direction substantially perpendicular to an extending direction thereof.

6. The evaporation mask according to claim 4, wherein

a plurality of the second opening sections are provided, and

each opening shape of the plurality of the second opening sections includes a comb-like shape in part or all thereof.

7. The evaporation mask according to claim 1, wherein a photosensitive resin layer is provided on the polymer film.

8. The evaporation mask according to claim 1, wherein a photosensitive resin layer is provided on a second main surface side of the substrate.

9. The evaporation mask according to claim 1, wherein

a plurality of the first opening sections and a plurality of the second opening sections are provided, and

the first opening section and the second opening section are arranged in a fashion of one-to-one correspondence.

10. The evaporation mask according to claim 1, wherein

a plurality of the second opening sections are provided, and

two or more second opening sections are arranged oppositely to one first opening section.

11. The evaporation mask according to claim 1, wherein a width of a cross-sectional shape of the first opening section is larger on the first main surface side of the substrate than on the second main surface side of the substrate.

12. An electronic device comprising:

a conductive film in a selective region on a substrate,

wherein in the conductive film, a foot section thereof is tilted with a slope being more moderate as its position is closer to the substrate side.

13. The electronic device according to claim 12, wherein the conductive film is a source electrode and a drain electrode of a transistor.

14. The electronic device according to claim 13 sequentially comprising from the substrate side:

a gate electrode;

a gate insulating film;

a semiconductor layer; and

a protective film,

wherein as the conductive film, the source electrode and the drain electrode are provided on the protective film, and

widths of part or all of the source electrode and the drain electrode are substantially equal to or less than 20 μ

m.

15. The electronic device according to claim 14, wherein the source electrode and the drain electrode respectively include a comb-like shape.

16. The electronic device according to claim 12, the electronic device is an organic thin film transistor.

17. A method of manufacturing an evaporation mask, comprising:

forming one or a plurality of first opening sections in a substrate; and

forming a polymer film including one or a plurality of second opening sections on a first main surface side of the substrate, the one or the plurality of second opening sections being communicated with the one or the plurality of first opening sections.

18. The method according to claim 17, wherein

after the polymer film is formed on the first main surface side of the substrate and then a photosensitive resin layer is pattern-formed on the polymer film, the second opening section is formed in the polymer film by etching with use of the photosensitive resin layer as a mask, and

after another photosensitive resin layer is pattern-formed on a second main surface side of the substrate, the first opening section is formed in the substrate by etching with use of said another photosensitive resin layer as a mask.

19. The method according to claim 17, wherein

after the polymer film is formed on the first main surface side of the substrate and subsequently a photosensitive resin layer is pattern-formed on the polymer film, the second opening section is formed in the polymer film by etching with use of the photosensitive resin layer as a mask, and

the first opening section is then formed in the substrate by etching with use of the polymer film including the second opening section as a mask.

20. A method of manufacturing an electronic device, the method comprising

forming a conductive film by using an evaporation mask,

wherein the evaporation mask includes a substrate and a polymer film, the substrate including one or a plurality of first opening sections, and the polymer film being provided on a first main surface side of the substrate and including one or a plurality of second opening sections communicated with the respective first opening sections.