LIGHT EMITTING DIODE PACKAGE
First Claim
Patent Images
1. A light emitting diode (LED) package comprising:
- a first metal line layer and a second metal line layer bonded to a circuit substrate;
a thin film substrate disposed on the first metal line layer and the second metal line layer and including an opening that exposes the first metal line layer and the second metal line layer; and
an LED disposed in the opening and contacting the first metal line layer and the second metal line layer.
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Abstract
A light emitting diode (LED) package is disclosed. The LED package includes a first metal line layer and a second metal line layer bonded to a circuit substrate, a thin film substrate disposed on the first metal line layer and the second metal line layer and configured to include an opening that exposes the first metal line layer and the second metal line layer, and an LED disposed in the opening and brought into contact with the first metal line layer and the second metal line layer.
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Citations
20 Claims
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1. A light emitting diode (LED) package comprising:
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a first metal line layer and a second metal line layer bonded to a circuit substrate; a thin film substrate disposed on the first metal line layer and the second metal line layer and including an opening that exposes the first metal line layer and the second metal line layer; and an LED disposed in the opening and contacting the first metal line layer and the second metal line layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A light emitting diode (LED) package comprising:
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a circuit substrate; a thin film substrate disposed on the circuit substrate and including a first opening and a second opening exposing the circuit substrate; a first metal line layer and a second metal line layer bonded to the thin film substrate, and respectively disposed in a first region which includes the first opening and a second region which includes the second opening; a metal bonding layer filling in the first opening and the second opening, thereby electrically connecting the first metal line layer and the second metal line layer with the circuit substrate; and an LED disposed on the first metal line layer and the second metal line layer. - View Dependent Claims (19, 20)
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Specification