INDUCTIVE STRUCTURE FORMED USING THROUGH SILICON VIAS
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Abstract
An inductor for an integrated circuit can include a first turn comprising a first through silicon via (TSV) coupled to a second TSV. The inductor can include a third TSV coupled to the second TSV.
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Citations
18 Claims
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1. (canceled)
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2. An inductor for an integrated circuit, the inductor comprising:
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a first turn comprising a first through silicon via (TSV) coupled to a second TSV; and a third TSV coupled to the second TSV, wherein; the first TSV comprises a first end and a second end; the second TSV comprises a first end and a second end; the second end of the first TSV is coupled to the second end of the second TSV using a first conductive material; the third TSV comprises a first end and a second end; the first end of the third TSV is coupled to the first end of the second TSV using a second conductive material; the first, second, and third TSVs are located within a first die; and at least one of the first conductive material or the second conductive material is formed within a different die of the integrated circuit coupled to the first die. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10)
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11. An integrated circuit structure, comprising:
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an inductor, wherein the inductor comprises; a first through silicon via (TSV) comprising a first end and a second end located within a first die of the integrated circuit structure; a second TSV comprising a first end and a second end located within the first die; a first bottom formed of a first conductive material configured to couple the second end of the first TSV with the second end of the second TSV; a third TSV comprising a first end and a second end located with in the first die; and a top formed of a second conductive material and configured to couple the first end of the second TSV with the first end of the third TSV; wherein at least one of the first bottom or the top is formed within a different die of the integrated circuit structure coupled to the first die. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18-20. -20. (canceled)
Specification