ELECTRONIC DEVICE THERMAL MANAGEMENT

• US 20130021750A1
• Filed: 07/08/2010
• Published: 01/24/2013
• Est. Priority Date: 07/08/2010
• Status: Abandoned Application

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Senatori, Mark David
• Application Number:
  US13/637,651
• Publication Number:
  US 20130021750A1
• Time in Patent Office: Days
• US Class Current: 361/695
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: G06F 1/3231 Monitoring the presence, absence or movement of users
• CPC Class Codes: Y02D 10/00 Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

A thermal management system for an electronic device comprising thermal management controller configured to adjust a temperature level of at least a portion of an interior of a housing of the electronic device based on a signal indicative of a change in an electrostatic field exterior to the housing of the electronic device.

Claims

1. A thermal management system for an electronic device comprising:

a thermal management controller configured to adjust a temperature level of at least a portion of an interior of a housing of the electronic device based on a signal indicative of a change in an electrostatic field exterior to the housing of the electronic device.

2. The thermal management system of claim 1, wherein the device is configured to generate the electrostatic field to the exterior of the housing.

3. The thermal management system of claim 1, wherein the device is configured to detect a thermal generating object located within the electrostatic field at the exterior of the housing.

4. The thermal management system of claim 1, wherein the signal indicative of a change in an electrostatic field is generated by a thermal generating object located within the electrostatic field at the exterior of the housing.

5. The thermal management system of claim 1, wherein the thermal management controller is further configured to adjust performance level of at least one electronic component disposed in the interior of the housing based on the signal indicative of a change in the electrostatic field exterior to the housing.

6. The thermal management system of claim 1, wherein the thermal management controller is further configured to adjust operation of at least one fan disposed in the interior of the housing based on the signal indicative of a change in the electrostatic field exterior to the housing.

7. The thermal management system of claim 1, wherein the thermal management controller is further configured to adjust operation of a baffling system disposed in the interior of the housing based on the signal indicative of a change in the electrostatic field exterior to the housing.

8. An electronic device comprising:

a display member; and

a base member comprising a housing configured to support a thermal management controller configured to adjust a temperature level of at least a portion of an interior of the housing based on a signal indicative of a change in an electrostatic field exterior to the housing.

9. The electronic device of claim 8, wherein the device is configured to generate the electrostatic field to the exterior of the housing.

10. The electronic device of claim 8, wherein the device is configured to detect a thermal generating object located within the electrostatic field at the exterior of the housing.

11. The electronic device of claim 8, wherein the signal indicative of a change in an electrostatic field is generated by a thermal generating object located within the electrostatic field at the exterior of the housing.

12. The electronic device of claim 8, wherein the thermal management controller is further configured to adjust performance level of at least one electronic component disposed in the interior of the housing based on the signal indicative of a change in the electrostatic field exterior to the housing.

13. The electronic device of claim 8, wherein the thermal management controller is further configured to adjust operation of at least one fan disposed in the interior of the housing based on the signal indicative of a change in the electrostatic field exterior to the housing.

14. The electronic device of claim 8, wherein the thermal management controller is further configured to adjust operation of baffling system disposed in the interior of the housing based on the signal indicative of a change in the electrostatic field exterior to the housing.

15. A thermal management method comprising:

detecting a change in an electrostatic field exterior to a housing of an electronic device; and

adjusting a temperature level of at least a portion of an interior of a housing of the electronic device based on the detected change in the electrostatic field.

16. The thermal management method of claim 15, wherein detecting a change in the electrostatic is caused by a thermal generating object located within the electrostatic field at the exterior of the housing.

17. The thermal management method of claim 15, further comprising generating the electrostatic field exterior to the housing.

18. The thermal management method of claim 15, further comprising adjusting performance level of at least one electronic component disposed in the interior of the housing based on the detected change in the electrostatic field.

19. The thermal management method of claim 15, further comprising adjusting operation of at least one fan disposed in the interior of the housing based on the detected change in the electrostatic field.

20. The thermal management method of claim 15, further comprising adjusting operation of a baffling system disposed in the interior of the housing based on the detected change in the electrostatic field.