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INTEGRATED CIRCUIT WITH ELECTROMAGNETIC INTRACHIP COMMUNICATION AND METHODS FOR USE THEREWITH

  • US 20130023210A1
  • Filed: 09/26/2012
  • Published: 01/24/2013
  • Est. Priority Date: 06/21/2006
  • Status: Active Grant
First Claim
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1. A method comprising:

  • interfacing a first circuit of a first integrated circuit die to a second circuit of a second integrated circuit die via a first electromagnetic coupling between a first bonding wire that couples the first circuit to the substrate and a second bonding wire that couples the second circuit to the substrate;

    wherein the second bonding wire is electrically isolated from the first bonding wire.

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