INTEGRATED CIRCUIT WITH ELECTROMAGNETIC INTRACHIP COMMUNICATION AND METHODS FOR USE THEREWITH
First Claim
1. A method comprising:
- interfacing a first circuit of a first integrated circuit die to a second circuit of a second integrated circuit die via a first electromagnetic coupling between a first bonding wire that couples the first circuit to the substrate and a second bonding wire that couples the second circuit to the substrate;
wherein the second bonding wire is electrically isolated from the first bonding wire.
7 Assignments
0 Petitions
Accused Products
Abstract
An integrated circuit includes a substrate and a first integrated circuit die having a first circuit coupled to the substrate via a first bonding wire, the first circuit having a first intra-chip interface. A second integrated circuit die has a second circuit coupled to the substrate via a second bonding wire, the second circuit having a second intra-chip interface, the second bonding wire electrically isolated from the first bonding wire. The first circuit communicates with the second circuit via the first intra-chip interface and the second intra-chip interface, and wherein the first intra-chip interface and the second intra-chip interface communicate via a first electromagnetic coupling between the first bonding wire and the second bonding wire.
-
Citations
25 Claims
-
1. A method comprising:
-
interfacing a first circuit of a first integrated circuit die to a second circuit of a second integrated circuit die via a first electromagnetic coupling between a first bonding wire that couples the first circuit to the substrate and a second bonding wire that couples the second circuit to the substrate; wherein the second bonding wire is electrically isolated from the first bonding wire. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. A method comprising:
-
interfacing a first circuit of an integrated circuit to a second circuit of the integrated circuit via a first electromagnetic coupling between a first bonding wire that couples the first circuit to the substrate and a second bonding wire that couples the second circuit to the substrate; wherein the second bonding wire is electrically isolated from the first bonding wire. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
-
-
25. A method comprising:
-
interfacing a first circuit of an integrated circuit to a second circuit of the integrated circuit via a first electromagnetic coupling between a first bonding wire that couples the first circuit to the substrate and a second bonding wire that couples the second circuit to the substrate; wherein the second bonding wire is electrically isolated from the first bonding wire; and wherein at least one of the first circuit and the second circuit include components of a wireless interface device for communication with an external network.
-
Specification