LIGHT-EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

• US 20130026520A1
• Filed: 05/21/2012
• Published: 01/31/2013
• Est. Priority Date: 07/27/2011
• Status: Active Grant

• Current Assignee: Advanced Optoelectronic Technology, Inc.
• Original Assignee: Advanced Optoelectronic Technology, Inc.
• Inventors: HU, PI-CHIANG, HSU, SHIH-YUAN
• Granted Patent: US 8,709,842 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Abstract

An LED package includes a substrate, an LED chip arranged on the substrate, and a light transmission layer arranged on a light output path of the LED chip. The substrate includes a first electrode and a second electrode separated and electrically insulated from the first electrode. The LED chip is electrically connected to the first electrode and the second electrode of the substrate. The light transmission layer comprises two parallel transparent plates and a fluorescent layer sandwiched between the two transparent plates. The LED package further includes a transparent encapsulation layer sealing the LED chip therein, and in one embodiment, the light transmission layer is located on the encapsulation layer and in another embodiment, the encapsulation layer also seals the light transmission layer therein. A method for manufacturing the LED package is also provided.

Claims

1. An LED (light emitting diode) package, comprising:

a substrate comprising a first electrode, and a second electrode separated and electrically insulated from the first electrode;

an LED chip arranged on the substrate, the LED chip being electrically connected to the first electrode and the second electrode of the substrate; and

a light transmission layer arranged on a light output path of the LED chip, the light transmission layer comprising two parallel transparent plates and a fluorescent layer sandwiched between the two transparent plates.

2. The LED package of claim 1, further comprising a transparent encapsulation layer located on the substrate, wherein the transparent encapsulation layer seals the LED chip therein.

3. The LED package of claim 2, wherein the light transmission layer is located on the transparent encapsulation layer.

4. The LED package of claim 2, wherein the light transmission layer is directly located on the LED chip, and the transparent encapsulation layer also seals the light transmission layer therein.

5. The LED package of claim 1, wherein the substrate comprises a plate which supports the first electrode and the second electrode, and the plate is made of an electrically insulated and thermally conductive material.

6. The LED package of claim 1, wherein a thickness of each of the transparent plates is greater than that of the fluorescent layer.

7. The LED package of claim 1, wherein a thickness of the fluorescent layer is less than 100 um.

8. The LED package of claim 1, wherein each of the transparent plates is a transparent ceramic plate.

9. A method for manufacturing an LED package, comprising steps of:

providing a substrate, the substrate comprising a plate and a plurality of pairs of first electrodes and second electrodes, each of the first electrodes being separated and electrically insulated from a corresponding second electrode;

arranging a plurality of LED chips on the substrate, each of the LED chips being electrically connected to a corresponding one of the first electrodes and a corresponding one of the second electrodes;

providing a light transmission layer on a light output path of each LED chip, the light transmission layer comprising two parallel transparent plates and a fluorescent layer sandwiched between the two transparent plates; and

processing the light transmission layer between the adjacent LED chips by etching, and cutting the substrate between the adjacent LED chips to obtain a plurality of separated LED packages.

10. The method of claim 9, further comprising a step of forming an encapsulation layer on the substrate to seal the LED chips therein.

11. The method of claim 10, wherein the light transmission layer is located on the encapsulation layer and during the processing of the light emission layer, the encapsulation layer is also processed by the etching.

12. The method of claim 10, wherein the light transmission layer is directly located on the LED chips, and the encapsulation layer also seals the light transmission layer therein.

13. The method of claim 9, wherein each LED chip is electrically connected to the corresponding one of the first electrodes and the corresponding one of the second electrodes by flip-chip.

14. The method of claim 9, wherein a thickness of each of the transparent plates is greater than that of the fluorescent layer.

15. The method of claim 9, wherein a thickness of the fluorescent layer is less than 100 um.

16. The method of claim 9, wherein each of the transparent plates is a transparent ceramic plate.

17. The method of claim 9, wherein the plate is made of an electrically insulated and thermally conductive material.

18. The method of claim 10, wherein the encapsulation layer is transparent.

19. The method of claim 18, wherein the encapsulation layer is made of transparent resin.