SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE
First Claim
1. A wiring substrate in which a semiconductor element is built, the wiring substrate comprising:
- a semiconductor element;
a peripheral insulating layer covering at least an outer circumferential side surface of the semiconductor element; and
an upper surface-side wiring line provided on the upper surface side of the wiring substrate,wherein the semiconductor element includes, on the upper surface side thereof, an internal terminal electrically connected to the upper surface-side wiring line,the internal terminal includes;
a first conductive part exposed out of an insulating surface layer of the semiconductor element;
an adhesion layer on the first conductive part; and
a second conductive part on the adhesion layer, andthe adhesion layer covers an exposed surface of the first conductive part, and is formed on a portion of the insulating surface layer around the exposed surface of the first conductive part, and the adhesion layer extends around the outer side of an outer edge of the second conductive part so as to surround the second conductive part.
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Accused Products
Abstract
A wiring substrate in which a semiconductor element is built includes a semiconductor element; a peripheral insulating layer covering at least an outer circumferential side surface of this semiconductor element; and an upper surface-side wiring line provided on the upper surface side of the wiring substrate. The semiconductor element includes an internal terminal electrically connected to the upper surface-side wiring line on the upper surface side of the semiconductor element. This internal terminal includes a first conductive part exposed out of an insulating surface layer of the semiconductor element; an adhesion layer on this first conductive part; and a second conductive part on this adhesion layer. The adhesion layer covers an exposed surface of the first conductive part, and is formed on a portion of the insulating surface layer around the exposed surface of the first conductive part, and the adhesion layer extends around the outer side of an outer edge of this second conductive part so as to surround the second conductive part.
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Citations
21 Claims
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1. A wiring substrate in which a semiconductor element is built, the wiring substrate comprising:
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a semiconductor element; a peripheral insulating layer covering at least an outer circumferential side surface of the semiconductor element; and an upper surface-side wiring line provided on the upper surface side of the wiring substrate, wherein the semiconductor element includes, on the upper surface side thereof, an internal terminal electrically connected to the upper surface-side wiring line, the internal terminal includes; a first conductive part exposed out of an insulating surface layer of the semiconductor element; an adhesion layer on the first conductive part; and a second conductive part on the adhesion layer, and the adhesion layer covers an exposed surface of the first conductive part, and is formed on a portion of the insulating surface layer around the exposed surface of the first conductive part, and the adhesion layer extends around the outer side of an outer edge of the second conductive part so as to surround the second conductive part. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification