PROBING APPARATUS FOR SEMICONDUCTOR DEVICES

• US 20130027072A1
• Filed: 11/28/2011
• Published: 01/31/2013
• Est. Priority Date: 07/28/2011
• Status: Active Grant

• Current Assignee: STAr Technologies, Inc. (Innotech Corp.)
• Original Assignee: STAr Technologies, Inc. (Innotech Corp.)
• Inventors: HSU, CHEN JUNG, TSENG, CHAO CHENG
• Granted Patent: US 8,988,092 B2
• Time in Patent Office: Days
• US Class Current: 324/755.01
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/2887 involving moving the probe head or the IC under test; docking stations moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence

Abstract

A probing apparatus for semiconductor devices comprises a primary circuit board and a signal-adapting board positioned on the primary circuit board. The primary circuit board includes an inner area having a plurality of first contacts and an outer area having a plurality of first terminals and second terminals, and the first contacts are electrically connected to the first terminals via first conductive members in the primary circuit board. The signal-adapting board includes a plurality of second contacts electrically connected to the first contacts via second conductive members in the signal-adapting board.

Claims

1. A probing apparatus for semiconductor devices, comprising:

a primary circuit board including an inner area having a plurality of first contacts and an outer area having a plurality of first terminals and second terminals, the first contacts being electrically connected to the first terminals via first conductive members in the primary circuit board; and

a signal-adapting board positioned on the primary circuit board, the signal-adapting board having a plurality of second contacts electrically connected to the first contacts via second conductive members in the signal-adapting board.

2. The probing apparatus for semiconductor devices of claim 1, wherein the first contacts are arranged in a ring-shaped manner.

3. The probing apparatus for semiconductor devices of claim 2, wherein the first contacts are arranged in a plurality of rings.

4. The probing apparatus for semiconductor devices of claim 1, wherein the second conductive members comprises a lateral portion configured to electrically connect one of the second contacts to one of first contacts.

5. The probing apparatus for semiconductor devices of claim 1, wherein the primary circuit board includes an opening substantially positioned at the center of the primary circuit board, and the signal-adapting board is circular and includes a central circular aperture exposing the opening.

6. The probing apparatus for semiconductor devices of claim 1, wherein the signal-adapting board is positioned on the inner area without covering the outer area.

7. The probing apparatus for semiconductor devices of claim 6, further comprising a power board positioned on the primary circuit board without covering the inner area and the outer area, and the power board has a plurality of power contacts electrically connected to the second terminals via power traces in the primary circuit board.

8. The probing apparatus for semiconductor devices of claim 7, wherein the power board is positioned in an intermediate area between the outer area and the inner area of the primary circuit board.

9. The probing apparatus for semiconductor devices of claim 7, wherein the power board is circular and includes a central circular aperture exposing the inner area of the primary circuit board.

10. The probing apparatus for semiconductor devices of claim 7, wherein the power contacts are grouped into a plurality of contact groups, the power board further includes a plurality of first connecting sites, and one of the first connecting sites is electrically connected to the power contacts of the same group.

11. The probing apparatus for semiconductor devices of claim 10, wherein the primary circuit board includes a plurality of second connecting sites, and the positions of the second connecting sites correspond to those of the first connecting sites.

12. The probing apparatus for semiconductor devices of claim 10, wherein the first connecting sites are positioned at a peripheral area of the power board.

13. The probing apparatus for semiconductor devices of claim 12, further comprising at least one connector configured to connect the primary circuit board and the power board.

14. The probing apparatus for semiconductor devices of claim 13, wherein the connector includes a socket portion positioned on the primary circuit board and a plug portion inserted in the socket portion with the power board between the socket portion and the plug portion.

15. The probing apparatus for semiconductor devices of claim 7, further comprising at least one power probe having a first tip configured to contact a first portion of a device under test and a second distal end electrically connected to one of the power contacts on the power board.

16. The probing apparatus for semiconductor devices of claim 1, further comprising at least one signal probe having a second tip configured to contact a second portion of the device under test and a second distal end electrically connected to one of the first contacts on the primary circuit board.

17. A probing apparatus for semiconductor devices, comprising:

a primary circuit board including an inner area having a plurality of first contacts and an outer area having a plurality of first terminals and second terminals, the first contacts being electrically connected to the first terminals via first conductive members in the primary circuit board; and

a power board positioned on the primary circuit board without covering the inner area, the power board having a plurality of second contacts electrically connected to the second terminals via at least second conductive members in the primary circuit board.

18. The probing apparatus for semiconductor devices of claim 17, wherein the power board is positioned on an intermediate area between the outer area and the inner area.

19. The probing apparatus for semiconductor devices of claim 17, wherein the primary circuit board includes a first layer and a second layer, the first conductive members include first traces positioned in the first layer, and the second conductive members include second traces positioned in the second layer.

20. The probing apparatus for semiconductor devices of claim 17, wherein the first contacts are signal contacts and the first terminals are signal terminals, and the second contacts are power contacts and the second terminals are power terminals.

21. The probing apparatus for semiconductor devices of claim 17, wherein the primary circuit board includes an opening substantially positioned at the center of the primary circuit board, and the inner area is between the opening and the outer area.

22. The probing apparatus for semiconductor devices of claim 17, wherein the power board is circular and includes a central circular aperture exposing the inner area of the primary circuit board.

23. The probing apparatus for semiconductor devices of claim 17, wherein the second contacts are grouped into a plurality of contact groups, the power board further includes a plurality of first connecting sites, and one of the first connecting sites is electrically connected to the second contacts of the same group.

24. The probing apparatus for semiconductor devices of claim 23, wherein the primary circuit board includes a plurality of second connecting sites, and the positions of the second connecting sites correspond to those of the first connecting sites.

25. The probing apparatus for semiconductor devices of claim 23, wherein the first connecting sites are positioned at a peripheral area of the power board.

26. The probing apparatus for semiconductor devices of claim 17, further comprising at least one connector configured to connect the primary circuit board and the power board.

27. The probing apparatus for semiconductor devices of claim 17, wherein the connector includes a socket portion positioned on the primary circuit board and a plug portion inserted in the socket portion with the power board between the socket portion and the plug portion.

28. The probing apparatus for semiconductor devices of claim 17, further comprising at least one power probe having a first tip configured to contact a first portion of a device under test and a first distal end electrically connected to one of the second contacts on the power board.

29. The probing apparatus for semiconductor devices of claim 17, further comprising at least one signal probe having a second tip configured to contact a second portion of the device under test and a second distal end electrically connected to one of the first contacts on the primary circuit board.