ANTENNA ARRAY PACKAGE AND METHOD FOR BUILDING LARGE ARRAYS
First Claim
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1. An array package for forming antenna arrays, the array package comprising:
- at least one bottom dielectric layer;
an array of antennas arranged in a plane above the at least one bottom dielectric layer;
a ground plane layer above the at least one bottom dielectric layer, the ground plane layer being electrically conductive; and
a conductive surface electrically connected to the ground plane layer, the conductive surface being carried by at least a part of an outside surface of the array package and orthogonal to the plane of the array of antennas.
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Abstract
Array packages and methods for forming large-scale antenna arrays. One method includes aligning two or more array packages. The two or more array packages each include one or more bottom dielectric layers, an array of antennas arranged in a plane above the one or more bottom dielectric layers, a ground plane layer above the one or more bottom dielectric layers, and a conductive surface on at least a part of an outside surface of the array package and orthogonal to the plane of the array of antennas. The conductive surface is electrically connected to the ground plane layer.
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Citations
25 Claims
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1. An array package for forming antenna arrays, the array package comprising:
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at least one bottom dielectric layer; an array of antennas arranged in a plane above the at least one bottom dielectric layer; a ground plane layer above the at least one bottom dielectric layer, the ground plane layer being electrically conductive; and a conductive surface electrically connected to the ground plane layer, the conductive surface being carried by at least a part of an outside surface of the array package and orthogonal to the plane of the array of antennas. - View Dependent Claims (2, 3, 4)
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5. An antenna system comprising:
at least two array packages electrically coupled together, each of the array packages comprising; at least one bottom dielectric layer; an array of antennas arranged in a plane above the at least one bottom dielectric layer; a ground plane layer above the at least one bottom dielectric layer, the ground plane layer being electrically conductive; and a conductive surface carried by at least a part of an outside surface of the array package and orthogonal to the plane of the array of antennas, the conductive surface electrically connected to the ground plane layer. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12)
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13. A method for forming an antenna array package, the method comprising:
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forming at least one bottom dielectric layer; forming an array of antennas arranged in a plane above the at least one bottom dielectric layer; forming a ground plane layer above the at least one bottom dielectric layer, the ground plane layer being electrically conductive; and forming a conductive surface carried by at least a part of an outside surface of the array package, the conductive surface electrically connected to the ground plane layer and orthogonal to the plane of the array of antennas. - View Dependent Claims (14, 15, 16)
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17. A method for forming antenna arrays, the method comprising:
aligning at least two array packages, the array packages each including;
at least one bottom dielectric layer, an array of antennas arranged in a plane above the at least one bottom dielectric layer, a ground plane layer above the at least one bottom dielectric layer, and a conductive surface carried by at least a part of an outside surface of the array package and orthogonal to the plane of the array of antennas, the ground plane layer being electrically conductive and the conductive surface electrically connected to the ground plane layer.- View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25)
Specification