SOLDER ALLOY, SOLDERING METHOD AND COMPONENT

• US 20130028783A1
• Filed: 04/12/2010
• Published: 01/31/2013
• Est. Priority Date: 04/12/2010
• Status: Abandoned Application

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Ott, Michael, Piegert, Sebastian
• Application Number:
  US13/639,113
• Publication Number:
  US 20130028783A1
• Time in Patent Office: Days
• US Class Current: 420/445
• CPC Class Codes: B23K 35/30 with the principal constituent melting at less than 1550 degrees C
• CPC Class Codes: F01D 5/005 Repairing methods or devices
• CPC Class Codes: F05D 2230/238 Soldering
• CPC Class Codes: Y02T 50/60 Efficient propulsion technologies, e.g. for aircraft

Abstract

A solder alloy including a base material, a solder, and an additive is provided. The solder alloy has the following formula:

(1−x−y)*base material+x*solder+y*additive,

• • where 0.2≦x≦0.8 and
  • 0≦y<0.8 and also (y<1−x).
    The base material includes chromium, nickel, aluminum, and tungsten. The solder includes chromium, cobalt, aluminum, tungsten, germanium and/or gallium, and nickel. The additive may include boron, zirconium, and carbon.

Claims

1-60. -60. (canceled)

61. A solder alloy, consisting of:

(1−

x−

y)*base material+x*solder+y*additive,

where 0.2≦

x≦

0.8 and

0≦

y<

0.8 and also (y<

1−

x),

wherein the base material comprises;

20 wt %-35 wt % chromium,

1 wt %-15 wt % nickel,

0.1 wt %-6 wt % aluminum, and

3 wt %-12 wt % tungsten,

wherein the solder comprises;

0.1 wt %-10 wt % chromium,

0.1 wt %-10 wt % cobalt,

0.1 wt %-6 wt % aluminum,

0.1 wt %-6 wt % tungsten,

germanium and/or gallium, and

at least 1 wt % nickel,

wherein the additive comprises;

0 wt %-0.010 wt % boron,

0 wt %-0.6 wt % zirconium, and

0 wt %-0.7 wt % carbon.

62. The solder alloy as claimed in claim 61, wherein the base material further comprises only one element selected from the group consisting of titanium, molybdenum and tantalum.

63. The solder alloy as claimed in claim 61, wherein the base material further comprises at least two elements selected from the group consisting of titanium, molybdenum and tantalum.

64. The solder alloy as claimed in claim 61, wherein the base material further comprises titanium, molybdenum and tantalum.

65. The solder alloy as claimed in claim 61, wherein the base material is cobalt-based.

66. The solder alloy as claimed in claim 61, wherein the solder comprises nickel as remainder.

67. The solder alloy as claimed in claim 61, wherein the solder alloy comprises cobalt as remainder.

68. The solder alloy as claimed in claim 61, wherein cobalt has the greatest proportion by weight.

69. The solder alloy as claimed in claim 61, wherein the additive comprises at least 0.01 wt % zirconium.

70. The solder alloy as claimed in claim 61, wherein the additive comprises at most 0.04 wt % zirconium.

71. The solder alloy as claimed in claim 61, wherein the additive comprises at least 0.05 wt % carbon.

72. The solder alloy as claimed in claim 61, wherein the additive comprises at most 0.55 wt % carbon.

73. The solder alloy as claimed in claim 61, where 0.3≦

x≦

0.5.

74. The solder alloy as claimed in claim 61, where y=0.

75. The solder alloy as claimed in claim 61, wherein 0.2≦

y.

76. The solder alloy as claimed in claim 61, wherein the solder comprises at least 1.5 wt % tungsten.

77. The solder alloy as claimed in claim 61, wherein the solder comprises at most 6.4 wt % tungsten.

78. The solder alloy as claimed in claim 61, wherein the solder further comprises at least 0.6 wt % tantalum.

79. The solder alloy as claimed in claim 61, wherein the solder further comprises at most 3.2 wt % tantalum.

80. The solder alloy as claimed in claim 61, wherein the gallium or germanium content is ≧

1.5 wt %.