METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE

• US 20130029445A1
• Filed: 07/25/2012
• Published: 01/31/2013
• Est. Priority Date: 07/25/2011
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: KIM, Gi Bum, HUR, Won Goo, LEE, Seung Jae, LEE, Si Hyuk, KIM, Tae Hun, CHOI, Seung Woo
• Application Number:
  US13/558,051
• Publication Number:
  US 20130029445A1
• Time in Patent Office: Days
• US Class Current: 438/33
• CPC Class Codes: H01L 33/007 comprising nitride compounds
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate

Abstract

There is provided a method of manufacturing a semiconductor light emitting device, the method including: preparing a substrate including first and second main surfaces opposing each other; forming a plurality of protruding parts in the first main surface of the substrate; forming a light emitting stack on the first main surface on which the plurality of protruding parts are formed; forming a plurality of light emitting structures by removing portions of the light emitting stack formed in regions corresponding to groove parts around the plurality of protruding parts; and separating the substrate along the groove parts.

Claims

1. A method of manufacturing a semiconductor light emitting device, the method comprising:

preparing a substrate including first and second main surfaces opposing each other;

forming a plurality of protruding parts in the first main surface of the substrate;

forming a light emitting stack including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer on the first main surface on which the plurality of protruding parts are formed;

forming a plurality of light emitting structures by removing portions of the light emitting stack formed in regions corresponding to groove parts around the plurality of protruding parts; and

separating the substrate along the groove parts so that individual semiconductor light emitting devices are obtained from the plurality of light emitting structures formed on the substrate.

2. The method of claim 1, wherein the groove parts are exposed to the outside in the removing of the portions of the light emitting stack formed in the regions corresponding to the groove parts around the plurality of protruding parts.

3. The method of claim 1, wherein, in the forming of the light emitting stack, at least portions of the groove parts remain empty.

4. The method of claim 1, wherein the groove parts have widths between about 10 μ

m and about 50 μ

m.

5. The method of claim 1, further comprising filling at least portions of the groove parts with a filling material.

6. The method of claim 5, wherein the filling material is resin or metal.

7. The method of claim 5, wherein the filling material has a high selective etching ratio with respect to the substrate.

8. The method of claim 5, further comprising removing a portion of the substrate from the second main surface to allow the filling material contained in the groove parts to be exposed to the outside.

9. The method of claim 8, wherein, in the separating of the substrate along the groove parts, the filling material exposed to the outside is removed.

10. The method of claim 9, wherein the removing of the filling material is performed by wet etching.

11. The method of claim 1, further comprising forming electrodes on the plurality of light emitting structures.

12. The method of claim 1, further comprising forming unevenness patterns on surfaces of the plurality of protruding parts.

13. The method of claim 12, wherein the light emitting stack is grown on sides of recess portions of the unevenness patterns.

14. The method of claim 1, wherein, in the separating of the substrate along the groove parts, a portion of the substrate is removed from the second main surface.

15. The method of claim 1, further comprising attaching a support substrate to the first main surface after the removing of the portions of the light emitting stack formed in the regions corresponding to the groove parts.

16. The method of claim 15, further comprising removing a portion of the substrate from the second main surface using a polishing process after the attaching of the support substrate.