INPUTTING MODULE AND SUBMOUNT THEREOF AND MANUFACTURING METHOD OF THE SUBMOUNT
First Claim
1. A submount for optical device is disposed on a plane and used for disposing an illuminant element or a light-receiving element having an optical axis, the submount comprising:
- a main body, comprising;
a first surface parallel to the plane and far away from the plane; and
a second surface parallel to the plane and adjacent to the plane;
wherein a disposing part of the first surface is tilted with respect to the second surface at a predetermined angle, the illuminant element or the light-receiving element is disposed on the disposing part and the optical axis of the illuminant element or the light-receiving element is tiled with respect to a normal of the second surface at the predetermined angle.
1 Assignment
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Accused Products
Abstract
A submount is used for disposing an illuminant element or a light-receiving element having an optical axis. The submount is disposed at a plane and has a main body. The main body includes a first surface and a second surface. The first surface is approximately parallel to the plane and far away from the plane. The second surface is approximately parallel to the plane and adjacent to the plane. A disposing part of the first surface is tilted with respect to the second surface at a predetermined angle. The illuminant element or the light-receiving element is disposed on the disposing part. The optical axis of the illuminant element or the light-receiving element is tiled with respect to a normal of the second surface at the predetermined angle.
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Citations
20 Claims
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1. A submount for optical device is disposed on a plane and used for disposing an illuminant element or a light-receiving element having an optical axis, the submount comprising:
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a main body, comprising; a first surface parallel to the plane and far away from the plane; and a second surface parallel to the plane and adjacent to the plane; wherein a disposing part of the first surface is tilted with respect to the second surface at a predetermined angle, the illuminant element or the light-receiving element is disposed on the disposing part and the optical axis of the illuminant element or the light-receiving element is tiled with respect to a normal of the second surface at the predetermined angle. - View Dependent Claims (2, 3, 4)
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5. An inputting module, comprising:
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a circuit board having an upper surface and a lower surface; an illuminant element package disposed on the upper surface of the circuit board, the illuminant element package comprising; a submount, comprising; a first surface which is parallel to the circuit board and far away from the circuit board; a second surface which is parallel to the circuit board and adjacent to the circuit board, a disposing part of the first surface is tilted with respect to the second surface at a predetermined angle; an illuminant element having an optical axis and disposed on the upper surface of the circuit board, the optical axis of the illuminant element is tilted with respect to a normal of the second surface at the predetermined angle; and a sensing element disposed on the upper surface of the circuit board, the sensing element comprising a sensing surface and a rear surface which is opposite to the sensing surface, the sensing surface having a sensing area. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A manufacturing method of a submount, the submount used for disposing an illuminant element or a light-receiving element, the method comprising:
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A. providing a silicon ingot; B. cutting the silicon ingot into at least a wafer along a predetermined lattice plane with a predetermined angle; C. coating a photoresist layer on a surface of the wafer; D. providing a mask and positioning on the surface which coated with the photoresist layer; E. providing a light source to illuminate the wafer to exposure the photoresist layer; F. removing the mask; G. providing a developing solution and putting the wafer into the developing solution to remove the non-necessity part of the photoresist layer; H. providing an etching solution and putting the wafer into the etching solution to form a plurality of recesses on the wafer; I. providing at least an electrode and attaching to the wafer; J. cutting the wafer into a plurality of submounts. - View Dependent Claims (18, 19, 20)
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Specification