ORGANIC LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING

• US 20130032831A1
• Filed: 07/30/2012
• Published: 02/07/2013
• Est. Priority Date: 08/03/2011
• Status: Active Grant

• Current Assignee: IGNIS Innovation Incorporated
• Original Assignee: IGNIS Innovation Incorporated
• Inventors: Chaji, Gholamreza, Moradi, Maryam
• Granted Patent: US 8,901,579 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H10K 59/127 comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/40 Thermal treatment, e.g. annealing in the presence of a solvent vapour
• CPC Class Codes: H10K 71/50 Forming devices by joining two substrates together, e.g. lamination techniques
• CPC Class Codes: H10K 71/621 Providing a shape to conductive layers, e.g. patterning or selective deposition

Abstract

Aspects of the present disclosure provide for manufacturing an organic light emitting diode (OLED) by forming two terminals of the OLED on two substrates of the display, and then depositing a plurality of layers of the OLED on one or both of the two terminals to form a first portion and a second portion of the OLED on each substrate. The two portions are joined together to form an assembled OLED. The deposition of the two portions can be stopped with each portion having approximately half of a common layer exposed. The two portions can then be aligned to be joined together and an annealing process can be employed to join together the two parts of the common layer and thereby form the OLED.

Claims

1. An organic light emitting diode comprising:

a first terminal formed on a first substrate of a display;

a second terminal formed on a second substrate of the display; and

a plurality of layers, including a first portion and a second portion, the first portion being formed on the first terminal, the second portion being formed on the second terminal, the first and second portion being joined together such that the plurality of layers are in between the first terminal and the second terminal.

2. The organic light emitting diode of claim 1, wherein the first terminal and the second terminal are each formed on the respective first and second substrates by a deposition process.

3. The organic light emitting diode of claim 1, wherein the first substrate is a transparent substrate encapsulating the display.

4. The organic light emitting diode of claim 1, wherein the second substrate is a substrate of a drain terminal of an n-type transistor for driving the organic light emitting diode.

5. The organic light emitting diode of claim 1, wherein the first terminal is an anode terminal of the organic light emitting diode and the second terminal is a cathode terminal of the organic light emitting diode.

6. The organic light emitting diode of claim 1, wherein the plurality of layers includes:

an emission layer, a hole transfer layer, or an electron transfer layer, and wherein the first portion and the second portion of the plurality of layers each include at least one layer of the plurality of layers.

7. The organic light emitting diode of claim 1, wherein the first portion of the plurality of layers includes a first part of a common layer, and the second portion of the plurality of layers includes a second part of the common layer, each of the first part and the second part being deposited distal the first and the second terminals of the organic light emitting diode, respectively, such that the first part and the second part of the common layer are each exposed responsive to the plurality of layers being deposited on the first and second substrates.

8. The organic light emitting diode of claim 7, wherein the first portion and the second portion of the plurality of common layers are joined together by annealing the first part and the second part of the common layer to form a unified common layer.

9. The organic light emitting diode of claim 8, wherein the common layer is an electron transfer layer.

10. The organic light emitting diode of claim 1, further comprising:

a first spacer included in the first portion of the plurality of layers; and

a second spacer included in the second portion of the plurality of layers, aligned such that the first spacer abuts the second spacer during the joining of the first portion of the plurality of layers and the second portion of the plurality of layers, and thereby ensures the plurality of layers from being compressed beyond a desirable amount.

11. The organic light emitting diode of claim 1, further comprising:

a bank for preventing an electron transfer layer of the plurality of layers from abutting a hole injection layer of the plurality of layers.

12. The organic light emitting diode of claim 1, wherein the plurality of layers includes a planarization layer.

13. A method of manufacturing an organic light emitting diode having a first terminal, a second terminal, and a plurality of layers between the first terminal and the second terminal, the method comprising:

forming, on a first substrate, the first terminal of the organic light emitting diode;

forming, on a second substrate, the second terminal of the organic light emitting diode;

developing a first portion of the plurality of layers on the first terminal;

developing a second portion of the plurality of layers on the second terminal; and

joining the first portion of the plurality of layers to the second portion of the plurality of layers such that the plurality of layers is situated in between the first terminal and the second terminal.

14. The method of claim 13, wherein the plurality of layers includes a common layer having a first part included in the first portion of the plurality of layers, the common layer having a second part included in the second portion of the plurality of layers, and wherein:

the developing the first portion of the plurality of layers includes depositing the first part of the common layer,

the developing the second portion of the plurality of layers includes depositing the second part of the common layer, and

the joining is carried out by annealing the first part and the second part of the common layer.

15. The method of claim 14, wherein the common layer is an electron transfer layer.

16. The method of claim 13, wherein the plurality of layers includes:

an emission layer, a hole transfer layer, or an electron transfer layer, and wherein the first portion and the second portion of the plurality of layers each include at least one layer of the plurality of layers.

17. The method of claim 13, further comprising:

prior to the joining, placing a first spacer on the first portion of the plurality of layers and a second spacer on the second portion of the plurality of layers, and wherein

during the joining, the first spacer abuts the second spacer so as to prevent the plurality of layers from being compressed.

18. The method of claim 13, wherein the developing the first portion of the plurality of layers or the developing the second portion of the plurality of layers includes placing a bank at a periphery of a hole transfer layer so as to prevent the hole transfer layer from abutting an electron transfer layer.

19. An organic light emitting diode prepared by a process comprising:

depositing, on a first substrate, a first terminal of the organic light emitting diode;

depositing, on a second substrate, a second terminal of the organic light emitting diode;

depositing a first portion of a common layer on the first terminal or on one or more layers deposited on the first terminal;

depositing a second portion of the common layer on the second terminal or on one or more layers deposited on the second terminal; and

annealing the first and second portions of the common layer so as to form a unified common layer and thereby join the first portion to the second portion.

20. The organic light emitting diode of claim 19, wherein the first substrate is a transparent substrate for encapsulating the display, and wherein the second substrate is a substrate of a drain or source terminal of a thin film transistor for driving the organic light emitting diode.

21. The organic light emitting diode of claim 19, wherein the common layer is an electron transfer layer.