POWER SUPPLY UNIT USING HOUSING IN WHICH PRINTED CIRCUIT BOARD IS HOUSED

• US 20130033818A1
• Filed: 08/01/2012
• Published: 02/07/2013
• Est. Priority Date: 08/01/2011
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: HOSODA, Tsuyoshi
• Granted Patent: US 8,995,130 B2
• Time in Patent Office: Days
• US Class Current: 361/688
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

In a power supply unit, a printed circuit board is provided on which two or more different-shape components are mounted. Such components include semiconductor devices. The printed circuit board has a designated mounting surface of the board. The housing is also provided, which houses the printed circuit board and comprises a cooling member for cooling a first space formed between the mounting surface and an opposed surface in the housing. The opposed surface is opposed to the mounting surface. The cooling member is arranged at part of the opposed surface, the part of the opposed surface projects toward the semiconductor devices, and the opposed surface is opposed to the two or more types of different-shape components.

Claims

1. A power supply unit comprising:

a printed circuit board on which two or more different-shape components having different heights when being mounted on the printed circuit board, wherein the different-shape components including at least semiconductor devices, the different-shape components are either different-shape components having a predetermined height or more when being mounted on the printed circuit board or two or more types of different-shape components, the printed circuit board has two or more mounting surfaces including a single designated mounting surface, and the semiconductor devices and the different-shape components are mounted on the designated mounting surface; and

a housing that houses the printed circuit board and comprises a cooling member for cooling a first space formed in the housing between the mounting surface of the printed circuit board and an opposed surface of the housing, wherein the opposed surface is opposed to the designated mounting surface, the cooling member is arranged at part of the opposed surface, the part of the opposed surface projects toward the semiconductor devices, and the opposed surface is opposed to the two or more types of different-shape components.

2. The power supply unit of claim 1, wherein the two or more types of different-shape components include specific different-shape components whose temperatures rise over a predetermined temperature when being operated, and

the specific different-shape components are located to directly so or indirectly be in touch with the cooling member or located near the cooling member.

3. The power supply unit of claim 2, wherein the opposed surface has one or more projections projecting toward the shape-different components.

4. The power supply unit of claim 3, comprising insert bus bars which are partly or entirely arranged between the mounting surface and the opposed surface to electrical connect circuit components on the mounting surface, the circuit components including at least the semiconductor devices.

5. The power supply unit of claim 4, wherein the casing has a second space other than the first space formed between the mounting surface and the opposed surface, the circuit components including circuit elements located in the second space, and

the insert bus bars include terminal sections for electrical connection with the circuit elements.

6. The power supply unit of claim 5, wherein the projected part of the opposed surface is located at an end portion of the opposed surface.

7. The power supply unit of claim 5, wherein the cooling member includes a cooling medium arranged under the projected part of the opposed surface and the opposed surface is a surface of a wall of the housing.

8. The power supply unit of claim 7, the projected part of the opposed surface is located at an end portion of the opposed surface, the end portion being opposed to the semiconductor devices.

9. The power supply unit of claim 3, the wall of the housing is a bottom of the housing, the bottom is made of a heat conductive material, the bottom is produced from a single plate having the projected part and the one or more projections.

10. The power supply unit of claim 3, wherein the cooling member includes a cooling medium arranged under the projected part of the opposed surface and the opposed surface is a surface of a wall of the housing.

11. The power supply unit of claim 10, the projected part of the opposed surface is located at an end portion of the opposed surface, the end portion being opposed to the semiconductor devices.

12. The power supply unit of claim 1, comprising insert bus bars which are partly or entirely arranged between the mounting surface and the opposed surface to electrical connect circuit components on the mounting surface, the circuit components including at least the semiconductor devices.

13. The power supply unit of claim 12, wherein the casing has a second space other than the first space formed between the mounting surface and the opposed surface, the circuit components including circuit elements located in the second space, and

the insert bus bars include terminal sections for electrical connection with the circuit elements.

14. The power supply unit of claim 13, wherein the projected part of the opposed surface is located at an end portion of the opposed surface.

15. The power supply unit of claim 2, comprising insert bus bars which are partly or entirely arranged between the mounting surface and the opposed surface to electrical connect circuit components on the mounting surface, the circuit components so including at least the semiconductor devices.

16. The power supply unit of claim 15, wherein the casing has a second space other than the first space formed between the mounting surface and the opposed surface, the circuit components including circuit elements located in the second space, and

the insert bus bars include terminal sections for electrical connection with the circuit elements.

17. The power supply unit of claim 16, wherein the projected part of the opposed surface is located at an end portion of the opposed surface.

18. The power supply unit of claim 1, wherein the projected part of the opposed surface is located at an end portion of the opposed surface.