LIGHT EMITTING MODULE AND HEAD LAMP INCLUDING THE SAME

• US 20130033885A1
• Filed: 03/06/2012
• Published: 02/07/2013
• Est. Priority Date: 08/02/2011
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: OH, Nam Seok, Cho, Yun Min, Lee, Jong Woo
• Granted Patent: US 9,169,988 B2
• Time in Patent Office: Days
• US Class Current: 362/516
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21S 41/151 arranged in one or more lines
• CPC Class Codes: F21S 41/285 Refractors, transparent cover plates, light guides or filters not provided in groups F21S41/24-F21S41/28
• CPC Class Codes: F21S 43/14 Light emitting diodes [LED]
• CPC Class Codes: F21S 43/255 Filters
• CPC Class Codes: F21S 45/10 Protection of lighting devices cooling of lighting devices F21S45/40; waterproofing of lighting devices F21S45/50
• CPC Class Codes: F21V 17/101 permanently, e.g. welding, gluing or riveting
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21V 3/08 the material comprising photoluminescent substances
• CPC Class Codes: F21V 3/10 characterised by coatings
• CPC Class Codes: F21V 3/12 the coatings comprising photoluminescent substances
• CPC Class Codes: F21W 2131/103 of streets or roads
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

Disclosed herein is a light emitting module. The light emitting module according to an exemplary embodiment includes a circuit board which has a cavity and includes a metal board, an insulation layer, and a circuit pattern, an insulation board disposed in the cavity, at least one light emitting device disposed on the insulation board, first and second pads disposed on the insulation board to be electrically connected with the light emitting device, and a conductive pad for electrically connecting the second pad and the circuit pattern.

Claims

1. A light emitting module comprising:

a circuit board which has a cavity and comprises a metal board, an insulation layer, and a circuit pattern;

an insulation board disposed in the cavity;

at least one light emitting device disposed on the insulation board;

first and second pad disposed on the insulation board to be electrically connected with the light emitting device; and

a conductive pad for electrically connecting the second pad and the circuit pattern.

2. The light emitting module according to claim 1, wherein the light emitting device is electrically connected to the first or second pad using at least one of wire bonding or conductive bonding.

3. The light emitting module according to claim 1, wherein the conductive pad is disposed on the second pad and the circuit pattern.

4. The light emitting module according to claim 1, further comprising a glass cover which is disposed on the circuit board.

5. The light emitting module according to claim 4, further comprising a support member disposed between the circuit board and the glass cover,

wherein the support member is disposed around the insulation board.

6. The light emitting module according to claim 5, wherein the support member comprises at least one of aluminum (Al), silver (Ag), platinum (Pt), rhodium (Rh), radium (Ra), palladium (Pd), or chromium (Cr).

7. The light emitting module according to claim 4, wherein the glass cover has an upper surface and side surfaces and at least one hole in at least one of the surfaces thereof.

8. The light emitting module according to claim 4, wherein the glass cover comprises an anti-reflective coating layer in at least one of the surfaces thereof.

9. The light emitting module according to claim 4, wherein the side surface of the glass cover is formed by a combination of faces having two or more heights different from one another.

10. The light emitting module according to claim 4, wherein the glass cover comprises a wavelength converting layer in at least a portion of the surfaces thereof.

11. The light emitting module according to claim 1, wherein the circuit pattern is disposed at the same height as the second pad.

12. The light emitting module according to claim 4, wherein the side surface of the glass cover comprises a slanted surface, and the slanted surface comprises a reflective layer containing at least one of aluminum (Al), silver (Ag), platinum (Pt), rhodium (Rh), radium (Ra), or palladium (Pd) to reflect light generated from the light emitting device.

13. The light emitting module according to claim 1, wherein the light emitting device comprises a light emitting structure which includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a first electrode on the first conductive type semiconductor layer, and a second electrode on the second conductive type semiconductor layer.

14. A light emitting module comprising:

a circuit board which has a through hole and comprises a metal board, an insulation layer, and a circuit pattern;

an insulation board disposed so as to allow at least a portion thereof to spatially overlap with the through hole;

at least one light emitting device disposed on the insulation board;

first and second pads disposed on the insulation board to be electrically connected with the light emitting device; and

a conductive pad for electrically connecting the second pad and the circuit pattern.

15. The light emitting module according to claim 14, further comprising a heat radiating member disposed on the insulation board.

16. The light emitting module according to claim 14, further comprising a glass cover which is disposed on the circuit board.

17. The light emitting module according to claim 14, wherein the circuit pattern is disposed at the same height as the second pad.

18. The light emitting module according to claim 15, further comprising a thermally conductive member disposed between the insulation board and the heat radiating member.

19. The light emitting module according to claim 16, wherein the glass cover has upper and side surfaces, and the side surface of the glass cover is formed by a combination of faces having two or more heights different from one another.

20. A head lamp comprising:

a light emitting module to emit light;

a reflector to reflect the light emitted from the light emitting module; and

a lens to refract the light emitted from the light emitting module and the light reflected by the reflector,

wherein the light emitting module comprises a circuit board which has a cavity and comprises a metal board, an insulation layer, and a circuit pattern;

an insulation board disposed in the cavity;

at least one light emitting device disposed on the insulation board;

first and second pads disposed on the insulation board to be electrically connected with the light emitting device; and

a conductive pad for electrically connecting the second pad and the circuit pattern.