METHOD AND SYSTEM FOR MONITORING MISHANDLING OF A DIGITAL X-RAY DETECTOR

• US 20130034213A1
• Filed: 08/05/2011
• Published: 02/07/2013
• Est. Priority Date: 08/05/2011
• Status: Abandoned Application

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Liu, James Zhengshe, Liu, Chuande, Konkle, Nicholas Ryan, Liu, Tan, Schley, Roy Allan
• Application Number:
  US13/204,516
• Publication Number:
  US 20130034213A1
• Time in Patent Office: Days
• US Class Current: 378/98.5
• CPC Class Codes: A61B 6/42 Arrangements for detecting radiation specially adapted for radiation diagnosis
• CPC Class Codes: A61B 6/461 Displaying means of special interest
• CPC Class Codes: A61B 6/563 involving image data transmission via a network
• CPC Class Codes: A61B 6/586 Detection of faults or malfunction of the device

Abstract

A digital X-ray detector includes a shock monitoring system configured to monitor for an occurrence of a shock event via at least one shock sensor. The detector also includes a processor configured to receive information related to the shock event from the shock monitoring system and to report the shock event to an X-ray system communicatively coupled to the detector.

Claims

1. A digital X-ray detector comprising:

a shock monitoring system configured to monitor for an occurrence of a shock event to the detector via at least one shock sensor; and

a processor configured to receive information related to the shock event from the shock monitoring system and to report the shock event to an X-ray system communicatively coupled to the detector.

2. The detector of claim 1, wherein the at least one shock sensor comprise 3-axis shock sensor.

3. The detector of claim 1, the detector comprising a plurality of shock sensors, and the plurality of shock sensors comprise at least one small-range vibration sensor and at least one large-range shock sensor.

4. The detector of claim 1, wherein the shock monitoring system comprises a microcontroller, a real-time clock, and a nonvolatile memory, and the microcontroller is configured to monitor the at least one shock sensor, to record 3-D peak shock values and timestamp for the shock event in the nonvolatile memory, and to report the shock event to the processor.

5. The detector of claim 4, wherein the microcontroller is configured to record the shock event if a single peak shock value in a single axis exceeds a predetermined threshold.

6. The detector of claim 4, wherein the at least one sensor comprises a small-range vibration sensor, and the microcontroller is configured to be in a sleep mode and to be awoken from the sleep mode to a full monitoring mode in response to the small-range vibration sensor sensing the shock event.

7. The detector of claim 4, wherein the microcontroller is configured to report the shock event immediately to the processor if the processor is active.

8. The detector of claim 4, wherein the microcontroller is configured to flag the shock event for subsequent reporting to the processor upon activation of the processor if the processor is inactive at time of shock event and to enable sleep mode after flagging the shock event.

9. The detector of claim 1, wherein the processor is configured to analyze the received information related to the shock event and assign a warning level based on the received information.

10. The detector of claim 9, wherein the warning level indicates a high-level shock event and potential damage to the detector due to the high-level shock event.

11. The detector of claim 9, wherein the warning level is determined based on peak shock values of the shock event.

12. The detector of claim 11, wherein the warning level comprises a low-level shock event based on the peak shock values exceeding only a first predetermined threshold or a high-level shock event based on the peak shock values exceeding a second predetermined threshold greater than the first predetermined threshold.

14. The X-ray system of claim 11, wherein the user-viewable warning indicates a low-level shock event to the detector.

15. The X-ray system of claim 11, wherein the user-viewable warning indicates a high-level shock event and potential damage to the detector due to the high-level shock event.

13. An X-ray system comprising:

an X-ray detector comprising a shock monitoring system configured to monitor for an occurrence of a shock event to the detector via at least one shock sensor and a main processor configured to receive information related to the shock event from the shock monitoring system and to report the shock event to an imaging system communicatively coupled to the detector; and

the imaging system comprising a processor configured to receive the information related to the shock event and a display configured to provide a user-viewable warning of the shock event.

16. The X-ray system of claim 13, wherein the user-viewable warning provides an indication to an operator to perform a quality assurance process to assess damage to the detector.

17. The X-ray system of claim 13, wherein the processor is configured to inhibit an exposure from a source of X-ray radiation of the imaging system due to the high-level shock event until performance of the quality assurance process verifies the detector is free of damage.

18. The X-ray system of claim 13, wherein the imaging system is configured to report the high-level shock event to a warrantee service system.

19. A method for analyzing mishandling of a digital X-ray detector comprising:

detecting a shock event to the detector via a shock monitoring system;

reporting the shock event to an X-ray system communicatively coupled to the detector; and

providing a user-viewable warning of the shock event to an operator of the X-ray system.

20. The method of claim 19, wherein the shock monitoring system comprises a plurality of shock sensors, the plurality of shock sensors comprising at least one small-range vibration sensor and at least one large-range shock sensor, the small-range vibration sensor is configured to initially detect the shock event, and the large-range sensor is configured to subsequently monitor the shock event.

21. The method of claim 19, the method comprising recording peak shock values and a timestamp for the shock event.

22. The method of claim 19, the method comprising analyzing the shock event to determine a severity of the shock event.

23. The method of claim 22, wherein analyzing the shock event comprises comparing peak shock values to predetermined thresholds to determine the severity of the shock event.

24. The method of claim 22, the method comprising inhibiting an exposure from a source of X-ray radiation of the X-ray system due to the severity of the shock event until a quality assurance process verifies the detector is free of damage.

25. The method of claim 24, wherein the user-viewable warning provides an indication to an operator to perform the quality assurance process to assess damage to the detector.