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CHEMICAL DISPERSION METHOD AND DEVICE

  • US 20130034966A1
  • Filed: 08/04/2011
  • Published: 02/07/2013
  • Est. Priority Date: 08/04/2011
  • Status: Abandoned Application
First Claim
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1. A method of semiconductor fabrication, the method comprising:

  • providing a substrate; and

    dispensing a first chemical spray onto the substrate using a first nozzle and dispensing a second chemical spray using a second nozzle onto the substrate.

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