CHEMICAL DISPERSION METHOD AND DEVICE
First Claim
1. A method of semiconductor fabrication, the method comprising:
- providing a substrate; and
dispensing a first chemical spray onto the substrate using a first nozzle and dispensing a second chemical spray using a second nozzle onto the substrate.
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Accused Products
Abstract
A method of semiconductor fabrication including providing a semiconductor wafer and dispensing a first chemical spray onto the wafer using a first nozzle and dispensing a second chemical spray using a second nozzle onto the wafer. These dispensing may be performed simultaneously. The method may further include moving the first and second nozzle. The first and second nozzle may provide the first and second chemical spray having at least one different property. For example, different chemical compositions, concentrations, temperatures, angles of dispensing, or flow rate. A chemical dispersion apparatus providing two nozzles which are operable to be separately controlled is also provided.
28 Citations
20 Claims
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1. A method of semiconductor fabrication, the method comprising:
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providing a substrate; and dispensing a first chemical spray onto the substrate using a first nozzle and dispensing a second chemical spray using a second nozzle onto the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method, the method comprising:
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providing a semiconductor wafer; providing a single-wafer chemical dispersion apparatus, wherein the single-wafer chemical dispersion apparatus includes a first and second nozzle disposed on an arm, wherein the second nozzle is spaced a distance from the first nozzle; determining a first setting for the first nozzle; determining a second setting for the second nozzle; applying a first chemical to the semiconductor wafer using the first nozzle at the first setting; and applying a second chemical to the semiconductor wafer using the second nozzle at the second setting. - View Dependent Claims (11, 12, 13, 14, 15)
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16. An apparatus, comprising:
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a wafer chuck; an arm device positioned above the wafer chuck; a first nozzle disposed on the arm device; a second nozzle disposed on the arm device and spaced a distance from the first nozzle; and a controller operably coupled to the arm device, wherein the controller is operable to separately control the first nozzle and the second nozzle. - View Dependent Claims (17, 18, 19, 20)
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Specification