AMORPHOUS OXIDE SEMICONDUCTOR THIN FILM TRANSISTOR FABRICATION METHOD
First Claim
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1. A method comprising:
- providing a substrate, the substrate having a surface, the surface including a source area, a drain area, and a channel area, the substrate including an oxide semiconductor layer on the surface of the substrate, a first dielectric layer on the oxide semiconductor layer overlying the channel area of the substrate, and a first metal layer on the first dielectric layer; and
implanting hydrogen ions in the oxide semiconductor layer overlying the source area and the drain area of the substrate to form doped n-type oxide semiconductor layers, wherein the implanting is performed via a plasma-immersion ion implantation process.
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Abstract
This disclosure provides systems, methods and apparatus for fabricating thin film transistor devices. In one aspect, a substrate having a source area, a drain area, and a channel area is provided. The substrate also includes an oxide semiconductor layer, a first dielectric layer overlying the channel area of the substrate, and a first metal layer on the dielectric layer. Hydrogen ions are implanted with a plasma-immersion ion implantation process in the oxide semiconductor layer overlying the source area and the drain area of the substrate. The hydrogen ion implantation forms a doped n-type oxide semiconductor in the oxide semiconductor layer overlying the source area and the drain area of the substrate.
40 Citations
29 Claims
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1. A method comprising:
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providing a substrate, the substrate having a surface, the surface including a source area, a drain area, and a channel area, the substrate including an oxide semiconductor layer on the surface of the substrate, a first dielectric layer on the oxide semiconductor layer overlying the channel area of the substrate, and a first metal layer on the first dielectric layer; and implanting hydrogen ions in the oxide semiconductor layer overlying the source area and the drain area of the substrate to form doped n-type oxide semiconductor layers, wherein the implanting is performed via a plasma-immersion ion implantation process. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method comprising:
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providing a substrate, the substrate having a surface, the surface including a source area, a drain area, and a channel area, the substrate including an oxide semiconductor layer on the surface of the substrate; implanting first ions in the oxide semiconductor layer via a first plasma-immersion ion implantation process; forming a first dielectric layer on the oxide semiconductor layer overlying the channel area of the substrate; forming a first metal layer on the first dielectric layer; and implanting hydrogen ions in the oxide semiconductor layer overlying the source area and the drain area of the substrate to form doped n-type oxide semiconductor layers, wherein the implanting is performed via a second plasma-immersion ion implantation process. - View Dependent Claims (16, 17, 18)
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19. An apparatus comprising:
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a substrate including a surface; an oxide semiconductor layer on the substrate surface, the oxide semiconductor layer including a channel region, a source region, and a drain region, the source region and the drain region of the oxide semiconductor layer being doped n-type oxide semiconductor layers implanted with hydrogen ions with a first plasma-immersion ion implantation process to a concentration of greater than about 1019 atoms/cm3, the channel region of the oxide semiconductor layer being implanted with an n-type dopant with a second plasma-immersion ion implantation process to a concentration of about 1014 to 1018 atoms/cm3; a first dielectric layer on the channel region of the oxide semiconductor layer; and a first metal layer on the first dielectric layer. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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Specification