LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE

• US 20130037842A1
• Filed: 01/28/2011
• Published: 02/14/2013
• Est. Priority Date: 02/09/2010
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Yamada, Motokazu, Seno, Ryota, Kamada, Kazuhiro
• Granted Patent: US 9,196,805 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45169 Platinum (Pt) as principal constituent
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 : comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01025 : Manganese [Mn]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01038 : Strontium [Sr]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01063 : Europium [Eu]
• CPC Class Codes: H01L 2924/01065 : Terbium [Tb]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12035 : Zener diode
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/2076 : equal to or larger than 100 microns
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2933/005 : relating to encapsulations
• CPC Class Codes: H01L 33/005 : Processes
• CPC Class Codes: H01L 33/483 : Containers
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/50 : Wavelength conversion elements
• CPC Class Codes: H01L 33/52 : Encapsulations
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).

Claims

1-36. -36. (canceled)

37. A light emitting device comprising:

a light emitting element having a semiconductor layer and a transparent substrate;

a reflective member exposing at least a part of side surfaces and a top surface of the transparent substrate and covering side surfaces of the semiconductor layer; and

a light transmissive member covering a portion of the transparent substrate exposed from the reflective member.

44. The light emitting device according to claim 37, wherein the surface of the light transmissive member has a recessed shape.

38. A light emitting device comprising:

a light emitting element having a semiconductor layer and a transparent substrate;

a reflective member exposing at least a part of side surfaces and a top surface of the transparent substrate and covering side surfaces of the semiconductor layer;

a light transmissive member covering a portion of the transparent substrate exposed from the reflective member; and

a base member and electrically conductive members disposed on the base member,

wherein the light emitting element is mounted on the electrically conductive members, at a surface of the electrically conductive members, at least a portion of which does not have the light emitting element mounted thereon is covered with an insulating filler which is the reflective member, and the light transmissive member covers the light emitting element.

45. The light emitting device according to claim 38, wherein the surface of the light transmissive member has a recessed shape.

47. The light emitting device according to claim 38, wherein the filler is applied to a thickness of 5 μ

m or greater.

49. The light emitting device according to claim 38, wherein a reflectance of the filler is 50% or greater to light of an emission wavelength.

51. The light emitting device according to claim 38, wherein the filler covers a surface of the light emitting element, and a surface area of a single light emitting element which is covered with the filler is less than 50% of the entire surface area of the single light emitting element.

53. The light emitting device according to claim 38, wherein the electrically conductive members respectively have a positive electrode and a negative electrode, the electrodes are disposed spaced apart from each other on the base member, and the filler is applied covering at least a portion between the electrodes.

55. The light emitting device according to claim 38, wherein the electrically conductive members respectively have a positive electrode and a negative electrode, the electrodes are disposed spaced apart from each other on the base member, and the filler is applied covering at least a portion between the electrodes, and wherein the distance between the electrodes is 200 μ

m or less.

56. The light emitting device according to claim 38, wherein the light emitting element is mounted in a flip-chip mounting manner.

58. The light emitting device according to claim 38, wherein a protective element is mounted in the light emitting device, and 50% or more of the surface area of the protective element is covered with the filler.

60. The light emitting device according to claim 38, wherein at least a portion of the filler is covered with a light blocking member.

62. The light emitting device according to claim 38, wherein at least a portion of the filler is covered with a light blocking member, and wherein the light blocking member covers a side walls of the base member.

63. The light emitting device according to claim 38, wherein the light transmissive member covers the filler in addition to the light emitting element.

39. A light emitting device comprising:

a light emitting element having a semiconductor layer and a transparent substrate;

a reflective member exposing at least a part of side surfaces and a top surface of the transparent substrate and covering side surfaces of the semiconductor layer;

a light transmissive member covering a portion of the transparent substrate exposed from the reflective member; and

a base member and electrically conductive members disposed on the base member,

wherein the light emitting element is mounted on the electrically conductive members, at a surface of the electrically conductive members, at least a portion of which does not have the light emitting element mounted thereon is covered with an insulating filler which is the reflective member, and the light transmissive member covers the light emitting element, and

wherein the base member has a recess and the electrically conductive members are disposed on a bottom surface and side surfaces of the recess, and the light emitting element is mounted on the bottom sutface of the recess.

40. The light emitting device according to claim 39, wherein the side surfaces of the recess has, at a portion abutting on a top edge surface of the recess have a region where an electrically conductive member is not formed.

41. The light emitting device according to claim 39, wherein the side surfaces of the recess at a portion abutting on the bottom surface of the recess have a region where an electrically conductive member is not formed.

42. The light emitting device according to claim 39, wherein at a top edge surface side of the recess, side surfaces of the recess have a step, and a side surface of the step has a region where an electrically conductive member is not formed.

43. The light emitting device according to claim 42, wherein a shortest distance between a highest surface of bottom surfaces of the step to a surface of the light transmissive member is ⅕

or less with respect to the height of the recess.

46. The light emitting device according to claim 39, wherein the surface of the light transmissive member has a recessed shape.

48. The light emitting device according to claim 39, wherein the filler is applied to a thickness of 5 μ

m or greater.

50. The light emitting device according to claim 39, wherein a reflectance of the filler is 50% or greater to light of an emission wavelength.

52. The light emitting device according to claim 39, wherein the filler covers a surface of the light emitting element, and a surface area of a single light emitting element which is covered with the filler is less than 50% of the entire surface area of the single light emitting element.

54. The light emitting device according to claim 39, wherein the electrically conductive members respectively have a positive electrode and a negative electrode, the electrodes are disposed spaced apart from each other on the base member, and the filler is applied covering at least a portion between the electrodes.

57. The light emitting device according to claim 39, wherein the light emitting element is mounted in a flip-chip mounting manner.

59. The light emitting device according to claim 39, wherein a protective element is mounted in the light emitting device, and 50% or more of the surface area of the protective element is covered with the filler.

61. The light emitting device according to claim 39, wherein at least a portion of the filler is covered with a light blocking member.

64. The light emitting device according to claim 39, wherein the light transmissive member covers the filler in addition to the light emitting element.