Semiconductor Device and Method of Forming a Stackable Semiconductor Package with Vertically-Oriented Discrete Electrical Devices as Interconnect Structures
First Claim
1. A method of making a semiconductor device, comprising:
- providing a first substrate;
mounting a first semiconductor die to the first substrate;
mounting a plurality of vertically-oriented discrete electrical devices over the first substrate with a first terminal of the vertically-oriented discrete electrical devices connected to the first substrate;
forming a plurality of bumps over the first substrate adjacent to the vertically-oriented discrete electrical devices;
depositing an encapsulant over and between the first semiconductor die and first substrate so that a portion of the bumps and a second terminal of the vertically-oriented discrete electrical devices opposite the first terminal is exposed from the encapsulant; and
forming an interconnect structure over a surface of the first substrate opposite the first semiconductor die.
5 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor device has a substrate and first semiconductor die to the substrate. A plurality of vertically-oriented discrete electrical devices, such as a capacitor, inductor, resistor, diode, or transistor, is mounted over the substrate in proximity to the first semiconductor die. A first terminal of the discrete electrical devices is connected to the substrate. A plurality of bumps is formed over the substrate adjacent to the discrete electrical devices. An encapsulant is deposited over and between the first semiconductor die and substrate. A portion of the bumps and a second terminal of the discrete electrical devices is exposed from the encapsulant. An interconnect structure is formed over a surface of the substrate opposite the first semiconductor die. The semiconductor devices are stackable and electrically connected through the substrate, discrete electrical devices, and bumps. A heat spreader or second semiconductor die can be disposed between the stacked semiconductor devices.
42 Citations
25 Claims
-
1. A method of making a semiconductor device, comprising:
-
providing a first substrate; mounting a first semiconductor die to the first substrate; mounting a plurality of vertically-oriented discrete electrical devices over the first substrate with a first terminal of the vertically-oriented discrete electrical devices connected to the first substrate; forming a plurality of bumps over the first substrate adjacent to the vertically-oriented discrete electrical devices; depositing an encapsulant over and between the first semiconductor die and first substrate so that a portion of the bumps and a second terminal of the vertically-oriented discrete electrical devices opposite the first terminal is exposed from the encapsulant; and forming an interconnect structure over a surface of the first substrate opposite the first semiconductor die. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A method of making a semiconductor device, comprising:
-
providing a first substrate; mounting a semiconductor die to the first substrate; mounting a discrete electrical device to the first substrate with a first terminal of the discrete electrical device connected to the first substrate; depositing an encapsulant over and between the semiconductor die and first substrate so that a second terminal of the discrete electrical device opposite the first terminal is exposed from the encapsulant; and forming a first interconnect structure over a surface of the first substrate opposite the semiconductor die. - View Dependent Claims (8, 9, 10, 11, 12, 13)
-
-
14. A method of making a semiconductor device, comprising:
-
providing a first substrate; mounting a semiconductor die to the first substrate; mounting a first terminal of a discrete electrical device over the first substrate; and depositing an encapsulant over the semiconductor die and first substrate so that a second terminal of the discrete electrical device opposite the first terminal is exposed from the encapsulant. - View Dependent Claims (15, 16, 17, 18, 19, 20)
-
-
21. A semiconductor device, comprising:
-
a substrate; a semiconductor die mounted to the substrate; a discrete electrical device mounted over the substrate with a first terminal of the discrete electrical device connected to the substrate; a first interconnect structure formed over the substrate adjacent to the discrete electrical device; an encapsulant deposited over the semiconductor die and substrate so that a second terminal of the discrete electrical device is exposed from the encapsulant; and a second interconnect structure formed over a surface of the substrate opposite the semiconductor die. - View Dependent Claims (22, 23, 24, 25)
-
Specification