DURABLE FINE WIRE LEAD FOR THERAPEUTIC ELECTROSTIMULATION AND SENSING

• US 20130041447A1
• Filed: 10/10/2012
• Published: 02/14/2013
• Est. Priority Date: 05/28/2008
• Status: Abandoned Application

• Current Assignee: Cardia Access, Inc.
• Original Assignee: Cardia Access, Inc.
• Inventors: Anderson, Kimberly, Lovoi, Paul A., Erb, John L.
• Application Number:
  US13/648,840
• Publication Number:
  US 20130041447A1
• Time in Patent Office: Days
• US Class Current: 607/119
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing

Abstract

A cardiac pacemaker, other CRT device or neurostimulator has one or more fine wire leads. Formed of a glass, silica, sapphire or crystalline quartz fiber with a metal buffer cladding, a unipolar lead can have an outer diameter as small as about 300 microns or even smaller. The buffered fibers are extremely durable, can be bent through small radii and will not fatigue even from millions of iterations of flexing. Bipolar leads can include several conductors side by side within a glass/silica fiber, or can be concentric metal coatings in a structure including several fiber layers. An outer protective sheath of a flexible polymer material can be included.

Claims

1. A flexible microthin fine wire or lead suitable for in vivo implantation, comprising a dual layer thin metal conductive buffer cladding on a nonconducting core.

2. The flexible wire or lead of claim 1, wherein the nonconducting core includes polymer, glass, silicon, ceramic or combinations thereof.

3. The flexible wire or lead of claim 1, wherein the dual layer thin metal conductive buffer cladding is aluminum, titanium, platinum gold, silver, or combinations thereof.

4. The flexible wire or lead of claim 1, wherein the dual layer thin metal conductive buffer cladding includes a first deposited layer of metal particulates having a size less than 1 micron.

5. The flexible wire or lead of claim 4, wherein the dual layer thin metal conductive buffer cladding includes a second deposited layer of metal macroparticles having a size greater than 1 micron.

6. The flexible wire or lead of claim 1, wherein the wire has a flexibility of up to five million cycles.

7. The wire or lead of claim 1 wherein the wire or lead includes a polymer.

8. The wire or lead of claim 7 wherein the wire or lead has a diameter of about 150 to about 250 nm.

9. The wire or lead of claim 1, including a cardiac pacemaker lead.

10. The wire or lead of claim 1, wherein the lead is configured and arranged for attachment to a device for controlling or monitoring electrical input.

11. A method of making a flexible fine wire or lead, the method comprising the steps of:

providing a non-conducting core made of glass, or silica or combinations thereof,

forming a first metal layer on the core by deposition of aluminum, titanium, platinum, gold, silver or combinations thereof, and

depositing a second metal layer on the first metal layer.

12. The method of claim 11, wherein the step of depositing the second metal layer includes ion plasma deposition.

13. The method of claim 11, wherein the thickness of the first metal layer is controlled to less than 1 micron.

14. The method of claim 11, wherein the thickness of the first metal layer is controlled to greater than 1 micron.

15. The method of claim 11, where in the first metal layer is silver.

16. The method of claim 11, wherein the first metal layer is a biocompatible metal.

17. The method of claim 11, wherein the first metal layer is gold or platinum.

18. A method of manufacturing a flexible fine stimulating lead, the method comprising the steps of:

providing an insulting biocompatible lead body,

affixing an electrode to the distal end of the lead body,

affixing a connector terminal to the proximal end of the lead body,

depositing at least one conductive metal layer on a non-conducting core to produce a fine wire lead for connecting the terminal to the electrode, and

depositing a biocompatible, insulting layer over the fine wire.

19. The method of claim 18, wherein the at least one conductive metal layer is from the group consisting of aluminum, titanium, platinum, gold, silver or combinations thereof.

20. The method of claim 18, wherein the non-conducting core is made of glass, or silica or combinations thereof.