DEVICE AND METHOD FOR INSPECTING MOVING SEMICONDUTOR WAFERS
First Claim
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1. A device for inspecting defects in semiconductor wafers comprising a member for detecting surface defects from variations in the slope of a surface of the wafer, the device comprising:
- a) a member for detecting surface defects from variations in the intensity of the light reflected by a surface of the wafer at a plurality of points;
b) a member for detecting the intensity of the light diffused by the surface of the wafer;
c) a light source; and
d) a detection and classification mechanism mounted downstream from these detection members.
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Abstract
Device for inspecting defects in semiconductor wafers, comprising a member for detecting surface defects using variations in the slope of a surface of the wafer, a member for detecting surface defects using variations in the light intensity reflected by a surface of the wafer, at a plurality of points, a member for detecting light intensity scattered by the surface of the wafer, a light source, and a detecting and classifying mechanism connected upstream of said detecting members.
14 Citations
15 Claims
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1. A device for inspecting defects in semiconductor wafers comprising a member for detecting surface defects from variations in the slope of a surface of the wafer, the device comprising:
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a) a member for detecting surface defects from variations in the intensity of the light reflected by a surface of the wafer at a plurality of points; b) a member for detecting the intensity of the light diffused by the surface of the wafer; c) a light source; and d) a detection and classification mechanism mounted downstream from these detection members. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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- 12. A process for inspecting defects in semiconductor wafers, comprising measuring the slope of a surface of the wafer using a first member for detecting surface defects, measuring variations in the intensity of the light reflected by a surface of the wafer using a second member for detecting surface defects, illuminating the surface of the wafer with a light source, and classifying surface defects using a detection classification mechanism mounted downstream from the detection members.
Specification