SURFACE PROFILE MEASUREMENT APPARATUS AND ALIGNMENT METHOD THEREOF AND AN IMPROVED SUB-APERTURE MEASUREMENT DATA ACQUISITION METHOD

• US 20130044332A1
• Filed: 08/20/2012
• Published: 02/21/2013
• Est. Priority Date: 08/20/2011
• Status: Abandoned Application

• Current Assignee: Tonta Electro Optical Co., Ltd.
• Original Assignee: Chao-Wen Liang
• Inventors: LIANG, Chao-Wen
• Application Number:
  US13/589,612
• Publication Number:
  US 20130044332A1
• Time in Patent Office: Days
• US Class Current: 356/512
• CPC Class Codes: G01M 11/0207 Details of measuring devices
• CPC Class Codes: G01M 11/025 by determining the shape of the object to be tested measuring contours or curvatures by optical means G01B11/24
• CPC Class Codes: G01M 11/0271 by using interferometric methods

Abstract

A surface profile measurement apparatus, which measures a surface profile of an object, includes a wavefront measurement unit, a driving unit and a rotation unit. The wavefront measurement unit has an image sensor and emits a detecting light. The driving unit has a plurality of stages for moving the object or the wavefront measurement unit. The rotation unit has a rotation axis, is disposed on one of the stages of the driving unit, and holds the object. When measuring the object, the rotation unit rotates the object and the image sensor simultaneously exposes and acquires a measurement data, formed by the detecting light reflected from the object. An alignment method of the surface profile measurement apparatus and an improved sub-aperture measurement data acquisition method are also disclosed.

Claims

1. A surface profile measurement apparatus, which measures a surface profile of an object, comprising:

a wavefront measurement unit, which has an image sensor and emits a detecting light;

a driving unit, which has a plurality of motion stages for moving the object or the wavefront measurement unit to proceed the surface curvature fitting; and

a rotation unit, which has a rotary axis and is disposed on one of the stages of the driving unit, wherein the rotation unit holds the object, and when measuring the object, the rotation unit rotates the object and the image sensor simultaneously exposes and acquires a measurement data formed by the detecting light from the object.

2. The measurement apparatus of claim 1, wherein the stages have a defocusing motion, a decentering motion and a tilting motion to proceed a surface curvature fitting process.

3. The measurement apparatus of claim 2, wherein the stages providing the tilting motion have a rotation axis, and the rotation axis is substantially parallel to the gravity direction.

4. The measurement apparatus of claim 1, wherein the object has a symmetrical axis, the wavefront measurement unit has an optical axis, and when measuring the object, the rotary axis is substantially collinear with the symmetrical axis and is substantially coplanar with the optical axis.

5. The measurement apparatus of claim 1, further comprising:

a rotational position measurement device, which is electrically connected to the wavefront measurement unit and acquires a rotational angle of the rotary axis,

wherein, when the wavefront measurement unit captures the measurement data, the wavefront measurement unit acquires the rotational angle of the rotary axis and correlates with the measurement data.

6. The measurement apparatus of claim 1, wherein the wavefront measurement unit is an interferometer, and when the rotation unit rotates the object, the wavefront measurement unit acquires the plural measurement data with different interference phase changes of the same measured points of the object.

7. The measurement apparatus of claim 6, wherein the plural measurement data with the different interference phase changes are induced from random mechanical vibrations generated from the motions of the wavefront measurement unit, the driving unit or the rotation unit.

8. The measurement apparatus of claim 6, further comprising:

an interference phase shifter, which is coupled to the rotation unit, the driving unit or the wavefront measurement unit, and when the object rotates, the interference phase shifter simultaneously phase shifts the plural measurement data with random or predictable interference phase changing.

9. An alignment method of a surface profile measurement apparatus, which is implemented with a surface profile measurement apparatus for measuring a surface profile of an object, the surface profile measurement apparatus comprising a wavefront measurement unit, a driving unit, a rotation unit and an object alignment unit, the rotation unit having a rotary axis, the object having a symmetric axis, and the wavefront measurement unit having an optical axis, the alignment method comprising:

disposing the object on the rotation unit;

the wavefront measurement unit emitting a detecting light, which proceeds a surface curvature fitting on a measured area of the object surface;

the rotation unit rotating the object to at least two different rotational angles and acquiring corresponding measurement data at the different rotational angles;

calculating an alignment error according to the measurement data acquired at different rotational angles; and

adjusting the object alignment unit according to the alignment error, whereby the rotary axis and the object axis are substantially collinear.

10. The alignment method of claim 9, wherein the object alignment unit has a multi-axis alignment adjustment platform for moving the object in two translational or two angular directions.

11. The alignment method of claim 9, wherein the surface profile measurement apparatus further comprises a measuring light alignment unit, which has a multi-axis alignment adjustment platform for moving the object in two translational or two angular directions, the alignment method further comprising:

moving the measuring light alignment unit, whereby the rotary axis and the optical axis of the wavefront measurement unit are coplanar substantially.

12. The alignment method of claim 9, wherein the alignment error is derived by a lens prescription of the object or travels of motions of the driving unit.

13. The alignment method of claim 9, wherein the alignment error comprises an angular or translational alignment error between the rotary axis of the rotation unit and the symmetric axis of the object.

14. The alignment method of claim 9, wherein the alignment error comprises an angular or translational alignment error between the rotary axis of the rotation unit and the optical axis of the wavefront measurement unit.

15. An improved sub-aperture measurement data acquisition method, which is implemented with a surface profile measurement apparatus comprising a driving unit, a rotation unit and a wavefront measurement unit, the data acquisition method comprising:

moving the driving unit and a measuring light emitted by the wavefront measurement unit proceeding multiple surface curvature fittings to the same measured area of an object, wherein one of the surface curvature fittings is along a first direction of the object;

rotating the rotation unit and the wavefront measurement unit acquiring a plurality of first measurement data and a plurality of secondary measurement data, wherein the acquired first measurement data have an elongated axis direction corresponding to the first direction of the object; and

correlating the first measurement data and the secondary measurement data with the coordinates of the object, wherein a part of the first measurement data and a part of the secondary measurement data are overlapped at the same coordinate position.

16. The data acquisition method of claim 15, further comprising:

adding a calibration data of the wavefront measurement unit to calibrate a wavefront error or a coordinate error induced from the wavefront measurement unit; and

correlating the calibrated first measurement data and the secondary measurement data with the coordinates of the object.

17. The data acquisition method of claim 15, wherein the elongated axis direction of the first measurement data correspondingly is the tangential direction of the object.

18. The data acquisition method of claim 15, wherein when the wavefront measurement unit obtains the first measurement data in a tangential direction of the object, the radius of curvature of the incident measuring light wavefront upon the measured area substantially equals the best fitted radius of curvature along the tangential direction of the measured area of the object.

19. The data acquisition method of claim 15, wherein the secondary measurement data has another elongated axis direction, which corresponds to a second direction of the object, and the first direction and the second direction are different.

20. The data acquisition method of claim 15, wherein when the wavefront measurement unit obtains the secondary measurement data with elongated axis in a sagittal direction of the object, the radius of curvature of the incident measuring light wavefront upon the measured area substantially equals the best fitted radius of curvature along the sagittal direction of the measured area of the object.