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FILM DEPOSITION APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND PLASMA GENERATING DEVICE

  • US 20130047923A1
  • Filed: 08/17/2012
  • Published: 02/28/2013
  • Est. Priority Date: 08/24/2011
  • Status: Abandoned Application
First Claim
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1. A film deposition apparatus which forms a film on a substrate by repeatedly performing a process of sequentially supplying a first process gas containing Si and a second process gas containing O2 inside a vacuum chamber, the film deposition apparatus comprising:

  • a turntable including a substrate mounting area formed on one surface of the turntable to mount a substrate, the turntable being configured to rotate the substrate mounting area inside the vacuum chamber;

    a first process gas supplying portion for supplying the first process gas to a first area over the turntable;

    a second process gas supplying portion for supplying the second process gas to a second area over the turntable, the second area being separated, in a peripheral direction of the turntable, from the first area by a separating area being provided over the turntable and interposing between the first area and the second area;

    a plasma generating gas supplying portion protruding inside the vacuum chamber to supply a plasma generating gas containing Ar and O2 used for applying plasma to the substrate inside the vacuum chamber;

    an antenna facing the substrate mounting area and being wound toward a direction perpendicular to the one surface of the turntable, the antenna being configured to convert the plasma generating gas to plasma using induction coupling; and

    a Faraday shield intervening between the antenna and the substrate and being made of a conductive plate which is grounded to prevent an electric field included in an electromagnetic field, which is generated around the antenna, from passing through the Faraday shield including;

    slits arranged on the conductive plate parallel to a loop of the antenna, the slits being opened on the conductive plate in directions perpendicular to a direction of arranging the slits to enable a magnetic field included in the electromagnetic field to reach the substrate,a window opened in an area of the conductive plate surrounded by the slits, the window is configured to enable observation of generation of the plasma,an inner conductive path which is formed between the slits and the window and grounded so as to prevent the window from communicating the slits, andan outer conductive path which is formed on a side opposite to the window relative to the slits and surrounds the slits.

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