SEMICONDUCTOR DEVICE PACKAGING HAVING PRE-ENCAPSULATION THROUGH VIA FORMATION USING DROP-IN SIGNAL CONDUITS

• US 20130049217A1
• Filed: 08/31/2011
• Published: 02/28/2013
• Est. Priority Date: 08/31/2011
• Status: Active Grant

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Gong, Zhiwei, Chhabra, Navjot, Daves, Glenn G., Hayes, Scott M., Mitchell, Douglas G., Wright, Jason R.
• Granted Patent: US 9,142,502 B2
• Time in Patent Office: Days
• US Class Current: 257/774
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

A semiconductor device package having pre-formed and placed through vias and a process for making such a package is provided. One or more signal conduits are placed in a holder that is subsequently embedded in an encapsulated semiconductor device package. The ends of the signal conduits are exposed and the signal conduits are then used as through package vias, providing signal-bearing pathways between interconnects or contacts on the bottom and top of the package. Holders can be provided in a variety of geometries and materials, depending upon the nature of the application. Further, multiple holders with signal conduits can be provided in a single package to provide for more complex interconnect configuration demands in, for example, system-in-a-package applications.

Claims

1. A method for packaging an electronic device assembly, the method comprising:

providing a conduit assembly comprising a holder and one or more signal conduits attached to the holder;

placing the conduit assembly in a first area for the electronic device assembly;

placing a first electronic device in a second area for the electronic device assembly;

forming an encapsulant over and around sides of the first electronic device and over and around sides of the conduit assembly; and

exposing a first end of a signal conduit of the one or more signal conduits and a second end of the signal conduit, wherein

the signal conduit forms a via through the encapsulated electronic device assembly, and

the signal conduit couples an interconnect formed on a first major surface of the encapsulated electronic device assembly with an interconnect formed on a second major surface of the encapsulated electronic device assembly.

2. The method of claim 1 wherein said exposing further comprises removing a portion of the encapsulant from the electronic device assembly.

3. The method of claim 2 wherein said removing further comprises one of:

grinding the encapsulant from the electronic device assembly to a depth matching the end of the signal conduit; and

laser ablating the encapsulant from the electronic device assembly to a depth matching the end of the signal conduit.

4. The method of claim 1 wherein said exposing further comprises performing said forming the encapsulant exposes the ends of conduit without removing a portion of the encapsulant.

5. The method of claim 1 further comprising:

providing a double-sided adhesive tape disposed on a carrier, wherein

said placing the pillar assembly comprises placing the pillar assembly on the tape with an end of each signal conduit in contact with the tape, and

said exposing comprises removing the tape from the encapsulated electronic device assembly.

6. The method of claim 1 wherein the holder comprises a metal holder and the one or more signal conduits are attached at an end of each signal conduit to the metal holder.

7. The method of claim 6 wherein said exposing comprises:

grinding the encapsulant from the electronic device assembly to a depth matching the metal holder; and

removing the metal holder from the electronic device assembly.

8. The method of claim 7 wherein said removing the metal holder comprises one of grinding the metal holder from the electronic device assembly or etching the metal holder from the electronic device assembly.

9. The method of claim 1 wherein the holder comprises a non-conductive material.

10. The method of claim 9 wherein the holder comprises:

one of a substrate core or a ceramic material and the one or more signal conduits are embedded in the holder; and

the first and second ends of the signal conduit are exposed.

11. The method of claim 9 wherein the conduit assembly comprises a conductive routing on one or both sides of the holder or inside the holder, wherein the conductive routing is coupled to one or more of the signal conduits.

12. The method of claim 1 further comprising:

providing a second conduit assembly comprising a second holder and second signal conduits attached to the second holder;

placing the second conduit assembly in a third area for the electronic device assembly;

forming the encapsulant over and around sides of the second conduit assembly; and

exposing first end of a second signal conduit of the second signal conduits and a second end of the second signal conduit, wherein

the second signal conduit forms a second via through the encapsulated electronic device assembly.

13. The method of claim 12 further comprising:

placing a second electronic device in a fourth area for the electronic device assembly; and

forming the encapsulant over and around sides of the second electronic device.

14. The method of claim 1 further comprising:

providing a frame or substrate in the first area for the electronic device assembly, wherein

said placing the conduit assembly comprises placing the first end of the signal conduit on the frame or substrate; and

attaching the first end of the signal conduit to the frame or substrate using a conductive bond.

15. The method of claim 1 further comprising:

coupling one of the first and second end of the signal conduit to an electrical contact of the first electronic device, wherein said coupling is performed using one of wire bond, flip chip bumping or other techniques.

16. A packaged device assembly comprising:

an electronic device;

one or more through vias extending from a top surface of the packaged device assembly to a bottom surface of the packaged device assembly; and

encapsulant over and around the electronic device and around the through vias and forming an encapsulated region of the packaged device assembly, wherein

the one or more through vias are formed using corresponding signal conduits, and

each signal conduit is formed before encapsulating the electronic device and signal conduits; and

a first interconnect structure formed on the top surface of the packaged device assembly and a second interconnect structure formed on the bottom surface of the packaged device assembly, wherein the first and second interconnect structures are coupled by the through vias.

17. The packaged device assembly of claim 16 further comprising:

a conduit assembly comprising a holder and the one or more signal conduits attached to the holder, wherein

the one or more signal conduits are aligned parallel to each other signal conduit, if any, and

each signal conduit has a length equal to a thickness of the encapsulated region.

18. The packaged device assembly of claim 17 wherein the holder comprises one of a substrate core or a ceramic material and the one or more signal conduits are embedded in the holder.

19. A method for packaging an electronic device, the method comprising:

providing one or more signal conduits, wherein each signal conduit has a length equal to a thickness of an encapsulated region of the package;

attaching the one or more signal conduits to a holder to form a conduit assembly;

placing the conduit assembly in a first area for the electronic device package;

placing a first electronic device in a second area for the electronic device package;

forming an encapsulant over and around sides of the first electronic device and over and around sides of the conduit assembly;

exposing a first end of a signal conduit of the one or more signal conduits and a second end of the signal conduit, wherein

the signal conduit forms a via through the encapsulated electronic device assembly;

forming a first interconnect structure on a first major surface of the electronic device package, wherein the first interconnect structure is coupled to the first end of the signal conduit; and

forming a second interconnect structure on a second major surface of the electronic device package, wherein the second interconnect structure is coupled to the second end of the signal conduit.

20. The method of claim 19 wherein said attaching the one or more signal conduits to the holder comprises one of

molding the holder material around the one or more signal conduits, and

pressing the one or more signal conduits into the holder material.