HIGH PERFORMANCE LIQUID COOLED HEATSINK FOR IGBT MODULES
First Claim
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1. A housing for use with a heat sink including a plurality of fins, said housing comprising:
- a first manifold defining a plurality of first passages; and
,a second manifold defining a plurality of second passages in fluid communication with the plurality of first passages, at least one of the plurality of first passages extending between an adjacent pair of the plurality of second passages and oriented to channel fluid toward at least one of the plurality of fins, wherein the plurality of fins are positioned within said housing.
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Abstract
A heat sink assembly includes a base plate coupled to a first side of an electronic device. A plurality of fins extend from the base plate and are positioned within a housing. The housing includes a first manifold defining a plurality of first passages and a second manifold defining a plurality of second passages in fluid communication with the plurality of first passages. At least one of the plurality of first passages extends between an adjacent pair of the plurality of second passages and is oriented to channel fluid toward at least one of the plurality of fins.
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Citations
20 Claims
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1. A housing for use with a heat sink including a plurality of fins, said housing comprising:
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a first manifold defining a plurality of first passages; and
,a second manifold defining a plurality of second passages in fluid communication with the plurality of first passages, at least one of the plurality of first passages extending between an adjacent pair of the plurality of second passages and oriented to channel fluid toward at least one of the plurality of fins, wherein the plurality of fins are positioned within said housing. - View Dependent Claims (2, 3, 4, 5)
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6. A heat sink assembly for use with an electronic device, said heat sink assembly comprising:
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a base plate coupled to a first side of the electronic device; a plurality of fins extending from said base plate; and
,a housing comprising a first manifold defining a plurality of first passages and a second manifold defining a plurality of second passages in fluid communication with the plurality of first passages, at least one of the plurality of first passages extending between an adjacent pair of the plurality of second passages and oriented to channel fluid toward at least one of said plurality of fins, wherein said plurality of fins are positioned within said housing. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for cooling an electronic device coupled to a heat sink assembly including a base plate and a plurality of fins extending from the base plate, said method comprising:
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positioning the plurality of fins within a housing including a first manifold defining a plurality of first passages and a second manifold defining a plurality of second passages in fluid communication with the plurality of first passages, at least one of the plurality of first passages extending between an adjacent pair of the plurality of second passages; and
,channeling fluid through at least one of the plurality of first passages, toward at least one of the plurality of fins, and through at least one of the second plurality of second passages. - View Dependent Claims (18, 19, 20)
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Specification