LIGHT MODULE SYSTEM

• US 20130051009A1
• Filed: 05/18/2010
• Published: 02/28/2013
• Est. Priority Date: 09/24/2009
• Status: Active Grant

• Current Assignee: Molex Incorporated
• Original Assignee: Molex Incorporated
• Inventors: Zaderej, Victor, McGowan, Daniel B., Nguyen, Dan, Grzegorzewska, Barbara, Picini, Michael
• Granted Patent: US 9,097,405 B2
• Time in Patent Office: Days
• US Class Current: 362/235
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21S 2/005 of modular construction
• CPC Class Codes: F21S 4/00 Lighting devices or systems using a string or strip of light sources
• CPC Class Codes: F21V 17/14 Bayonet-type fastening
• CPC Class Codes: F21V 17/162 the parts being subjected to traction or compression, e.g. coil springs
• CPC Class Codes: F21V 17/164 the parts being subjected to bending, e.g. snap joints
• CPC Class Codes: F21V 19/001 the light sources being semiconductors devices, e.g. LEDs
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/85 characterised by the material liquid coolants F21V29/56
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

A light module system includes a receptacle, which may be mounted on a support surface, such as a heat sink, and further includes a cover and an LED assembly rotatably coupled to the cover. The LED assembly seats within the receptacle which causes terminals of the LED assembly to align with contacts on the receptacle. One of the cover and the receptacle has a plurality of ramps and the other has a plurality of shoulders. The cover can be rotated relative to the receptacle to cause the shoulders to slide relative to the ramps so as to direct the LED assembly into the receptacle. When the LED assembly is attached to the receptacle, the terminals on the LED assembly mate with the contacts on the receptacle.

Claims

1. An illumination system comprising:

a receptacle;

a light emitting diode (“

LED”

) assembly positioned within the receptacle, the LED assembly including an LED array with an anode and a cathode, the LED assembly translatable with respect to the in the receptacle in a vertical direction between an initial and an installed position; and

a first cover rotatably coupled to the LED assembly and engaging the receptacle, the first cover configured to rotate relative to the receptacle, wherein rotation of the first cover causes the first cover to translate vertically relative to the receptacle, wherein the vertical translation of the first cover causes the LED assembly to translate vertically, the translation of the LED assembly being substantially without rotational translation.

2. The system of claim 1, wherein the LED assembly includes a heat spreader having a lower surface and an upper surface in thermal communication with LED array and further includes a thermal pad on the lower surface of the heat spreader.

3. The system of claim 2, wherein the LED assembly includes a reflector.

4. The system of claim 3, wherein the LED assembly includes an electrical connector with a first and second terminal, the first and second terminal configured to engage recessed mating terminals, the first terminal in electrical communication with the anode and the second terminal in electrical communication with the cathode.

5. The system of claim 4, further comprising a biasing element between the first cover and the LED assembly, the biasing element configured to urge the LED assembly away from the first cover.

6. The system of claim 5, wherein the receptacle supports a third and fourth contact, the third and fourth contact being recessed so as to inhibit a person from touching the third or fourth contact, the third and fourth contact configured to make a respective electrical connection with the first and second terminal when the LED assembly is in the installed position.

7. The system of claim 6, wherein the thermal pad is compliant and has a thermal conductivity of at least one W/m-K.

8. The system of claim 7, wherein the thermal pad has a thickness of less than one mm.

9. The system of claim 8, further including a second cover releasably attached to the first cover and covering the LED assembly, the second cover configured to protect the LED assembly from damage.

10. The system of claim 9, wherein the receptacle includes a plurality of bosses, the bossed configured to secure the receptacle to a supporting surface.

11. The system of claim 10, wherein the receptacle includes a plurality of ramps and the first cover includes a plurality of shoulders that engage the ramps, wherein rotation of the first cover with respect to the receptacle causes the shoulders to slide along the respective ramps.

12. An illumination system comprising:

a receptacle supporting a first and second contact;

a light emitting diode (“

LED”

) assembly rotationally constrained by the receptacle, the LED assembly including an LED array with an anode and cathode and a first and second terminal, the first terminal in electrical communication with the anode and the second terminal in electrical communication with the cathode;

a cover engaging the receptacle and coupled to the LED assembly, the cover rotatable with respect to the receptacle, wherein rotation of the cover causes the cover to translate vertically relative to the receptacle;

a heat spreader with a lower surface and an upper surface supported by the LED assembly, the upper surface in thermal communication with the LED array; and

a thermal pad provided on the lower surface.

13. The system of claim 12, wherein the light module includes an insulative support with an aperture, the LED array positioned in the aperture and secured to the support.

14. The system of claim 13, wherein the support includes a first and second trace, the first trace extending from the first terminal to the anode and the second terminal extending from the second terminal to the cathode.

15. The system of claim 14, wherein the thermal resistance between the LED array and the lower surface is less than two K/W.

16. The system of claim 15, wherein the thermal pad has a thermal conductivity of greater than one W/m-K.

17. The system of claim 16, wherein the LED array is supported by a thermally conductive base that is thermally coupled to the heat spreader, the base including the anode and the cathode and the anode and cathode being respectively soldered to the first and second trace.

18. The system of claim 17, wherein the thermal resistance between the LED array and the heat spreader is less than one K/W.

19. An illumination system comprising:

a support surface;

a receptacle supporting a first and second contact and mounted on the support surface;

a light emitting diode (“

LED”

) assembly rotationally constrained by the receptacle, the LED assembly including an LED array with an anode and cathode and a first and second terminal, the first terminal in electrical communication with the anode and the second terminal in electrical communication with the cathode;

a cover engaging the receptacle and coupled to the LED assembly, the cover rotatable with respect to the receptacle, wherein rotation of the cover, in operation, causes the cover to translate vertically relative to the receptacle;

a heat spreader with a lower surface and an upper surface supported by the LED assembly, the upper surface in thermal communication with the LED array; and

a thermal pad provided on the lower surface, wherein the cover exerts a compressive force on the light emitting diode assembly so that the thermal pad is compressed between the support surface and the heat spreader.

20. The system of claim 19, wherein the thermal resistance between the LED array and the support surface is less than three K/W.