COMPOSITE ELECTRODE AND METHOD OF MANUFACTURE THEREOF
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Accused Products
Abstract
The present invention provides a composite electrode and method of manufacturing such a composite electrode, the method comprising the steps of: providing a first substrate layer with an electrically conducting surface; providing a non-conducting curable material; providing a second substrate layer which has a surface relief pattern defining at least one retaining feature corresponding to a desired metal track pattern; forming a line of contact between the conducting carrier layer and at least a part of the surface relief pattern; depositing curable material onto at least part of the surface relief pattern or the electrically conducting surface along the line of contact; advancing the line of contact and curing the curable material through the second substrate layer; releasing the cured material from the surface relief pattern feature so as to leave behind a surface relief pattern on the conducting carrier layer; depositing a first metal layer onto the exposed regions of the electrically conducting surface of the conducting carrier layer and optionally deposition further metal layers on the first metal layer.
33 Citations
48 Claims
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1-33. -33. (canceled)
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34. A method of manufacturing a composite electrode comprising the steps of:
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providing a conducting carrier layer being a first substrate layer with an electrically conducting surface; providing a non-conducting at least radiation curable material; providing a second substrate layer which is transparent at a wavelength of radiation used to cure the radiation curable material and which has a surface relief pattern defining at least one retaining feature corresponding to a desired metal track pattern; forming a line of contact between the conducting carrier layer and at least a part of the surface relief pattern; depositing the curable material onto at least part of the surface relief pattern or the electrically conducting surface along the line of contact; advancing the line of contact and curing the curable material through the second substrate layer; releasing the cured material from the at least part of the surface relief pattern feature so as to leave behind a surface relief pattern on the conducting carrier layer; selectively removing at least part of the surface relief pattern so as to selectively expose the electrically conducting surface of the conducting carrier layer; depositing a first metal layer onto the exposed regions of the electrically conducting surface of the conducting carrier layer; depositing an adhesive layer over the surface relief pattern on the conducting carrier layer after metal deposition; contacting the adhesive layer to a third substrate layer; and removing the conducting carrier layer. - View Dependent Claims (35, 36, 37, 38, 39, 40, 41, 42, 43)
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44. A composite electrode comprising a substrate, a dielectric layer and at least one conductive metal track, the at least one conductive metal track being embedded within the dielectric layer and having a surface being substantially planar with a surface of the dielectric layer;
wherein substantially planar is defined as, relative to the surface of the dielectric layer, the surface of the at least one conductive metal track has an average maximum height difference of between 5 nm to 150 nm. - View Dependent Claims (45, 46, 47, 48)
Specification