Method of Manufacturing Dummy Gates in Gate Last Process

• US 20130059435A1
• Filed: 11/30/2011
• Published: 03/07/2013
• Est. Priority Date: 09/01/2011
• Status: Active Grant

• Current Assignee: Institute of Microelectronics Chinese Academy of Sciences
• Original Assignee: Institute of Microelectronics Chinese Academy of Sciences
• Inventors: Yang, Tao, Zhao, Chao, Yan, Jiang, Li, Junfeng, Lu, Yihong, Chen, Dapeng
• Granted Patent: US 8,541,296 B2
• Time in Patent Office: Days
• US Class Current: 438/589
• CPC Class Codes: H01L 21/28114 characterised by the sectional shape, e.g. T, inverted-T
• CPC Class Codes: H01L 21/31111 by chemical means
• CPC Class Codes: H01L 21/32139 using masks
• CPC Class Codes: H01L 29/51 Insulating materials associated therewith for MIS structures on thin film semiconductor H01L29/4908
• CPC Class Codes: H01L 29/66545 using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate

Abstract

The present invention provides a method of manufacturing a dummy gate in a gate last process, which comprises the steps of forming a dummy gate material layer and a hard mask material layer sequentially on a substrate; etching the hard mask material layer to form a top-wide-bottom-narrow hard mask pattern; dry etching the dummy gate material layer using the hard mask pattern as a mask to form a top-wide-bottom-narrow dummy gate. According to the dummy gate manufacturing method of the present invention, instead of vertical dummy gates used conventionally, top-wide-bottom-narrow trapezoidal dummy gates are formed, and after removing the dummy gates, trapezoidal trenches can be formed. It facilitates the subsequent filling of the high-k or metal gate material and enlarges the window for the filling process; as a result, the device reliability will be improved.

Claims

1. A method of manufacturing a dummy gate in a gate last process, which comprises the following steps:

forming a dummy gate material layer and a hard mask material layer sequentially on a substrate;

etching the hard mask material layer to form a top-wide-bottom-narrow hard mask pattern; and

dry etching the dummy gate material layer using the hard mask pattern as a mask to form a top-wide-bottom-narrow dummy gate.

2. The method according to claim 1, wherein the hard mask material layer comprises a first mask layer and a second mask layer located on the first mask layer.

3. The method according to claim 2, wherein a hard mask pattern with vertical sidewalls is formed first by dry etching, then the first mask layer is wet etched to form the top-wide-bottom-narrow hard mask pattern.

4. The method according to claim 3, wherein in the formed top-wide-bottom-narrow hard mask pattern, the second mask layer has an over-hang portion beyond the first mask layer.

5. The method according to claim 4, wherein the width of the over-hang portion and the thickness of the dummy gate material layer are adjusted to control an angle of inclination of the dummy gate.

6. The method according to claim 2, wherein the top-wide-bottom-narrow hard mask pattern is formed by wet etching the hard mask material layer in a single step with wet etching solution, which etches the first mask layer faster than etches the second mask layer.

7. The method according to claim 2, wherein the first mask layer and the second mask layer comprise silicon oxide, silicon nitride and/or silicon oxynitride.

8. The method according to claim 3, wherein etching solution for the wet etching includes DHF, BOE, hot phosphoric acid or H₂O₂.

9. The method according to claim 1, wherein the dummy gate material layer comprises polycrystalline silicon, amorphous silicon, or microcrystal silicon, and the substrate comprises bulk silicon, SOI, monocrystalline germanium, GeOI, SiGe, SiC, InSb, GaAs or GaN.

10. A gate last process, which comprises the steps of:

forming a top-wide-bottom-narrow dummy gate on a substrate using the method of manufacturing a dummy gate in a gate last process as claimed in claim 1;

forming sidewall spacers on both sides of the dummy gate;

removing the dummy gate to form a top-wide-bottom-narrow gate trench; and

filling the gate trench with a gate insulation layer and a gate material.

11. The method according to claim 6, wherein etching solution for the wet etching includes DHF, BOE, hot phosphoric acid or H₂O₂.