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METHOD AND SYSTEM FOR DETECTING AND CORRECTING PROBLEMATIC ADVANCED PROCESS CONTROL PARAMETERS

  • US 20130060354A1
  • Filed: 08/29/2012
  • Published: 03/07/2013
  • Est. Priority Date: 09/01/2011
  • Status: Active Grant
First Claim
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1. A method for monitoring a feedback process control system, comprising the steps of:

  • receiving a plurality of applied process control parameters associated with adjusting a semiconductor wafer process tool of a semiconductor device processing line;

    measuring overlay error at a plurality of metrology target locations of a semiconductor wafer;

    determining a set of measured parameters based on the measured overlay errors;

    determining a set of revised process control parameters by comparing the applied process control parameters to the measured parameters;

    determining at least one of a first set of statistical parameters associated with the measured parameters and a second set of statistical parameters associated with the revised process control parameters; and

    displaying at least one of the first set of statistical parameters and the second set of statistical parameters.

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