FULLY INTEGRATED THERMOELECTRIC DEVICES AND THEIR APPLICATION TO AEROSPACE DE-ICING SYSTEMS
First Claim
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1. A thermoelectric module comprising:
- an integrated, layered structure comprising;
first and second, thermally conductive, surface volumes, each in thermal communication with a separate respective first and second electrically conductive patterned trace layers; and
an array of n-type and p-type semiconducting elements embedded in amorphous silica dielectric and electrically connected between the first and second patterned trace layers forming a thermoelectric circuit.
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Abstract
A thermoelectric module and methods for making and applying same provide an integrated, layered structure comprising first and second, thermally conductive, surface volumes, each in thermal communication with a separate respective first and second electrically conductive patterned trace layers, and an array of n-type and p-type semiconducting elements embedded in amorphous silica dielectric and electrically connected between the first and second patterned trace layers forming a thermoelectric circuit.
33 Citations
21 Claims
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1. A thermoelectric module comprising:
an integrated, layered structure comprising; first and second, thermally conductive, surface volumes, each in thermal communication with a separate respective first and second electrically conductive patterned trace layers; and an array of n-type and p-type semiconducting elements embedded in amorphous silica dielectric and electrically connected between the first and second patterned trace layers forming a thermoelectric circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A microelectronic circuit module comprising:
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a heat producing semiconductor chip mounted on a packaging element that has micro-channels through which a working fluid is passed to collect and transfer heat from the semiconductor chip; a thermoelectric module comprising a network of micro-channels embedded within silica dielectric through which the heated working fluid is circulated; and a first thermally isolated thermoelectric circuit embedded within silica dielectric that consists of a linear array of MAX-phase electrodes interleaved between alternating n-type and p-type semiconducting elements, wherein the MAX-phase electrodes contain micro-channels through which the working fluid is circulated and progressively cooled. - View Dependent Claims (14, 15)
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- 16. An anti-icing or de-icing system, comprising a thermoelectric layer forming a leading edge of an aerodynamic surface.
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20. A method for forming an integrated thermoelectric layer using metalorganic spray deposition techniques comprising:
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selectively forming one or more first electrical contact pads on a first side of a substrate surface; selectively forming a lower surface volume adjacent to said formed first electrical contact pad; selectively forming a lower patterned electrical trace layer from an electrically conductive material upon said first electrical contact pad and lower surface volume; selectively forming n-type and p-type semiconductor elements to a predetermined thickness upon select portions of said lower patterned electrical trace layer; selectively forming an electrically and thermally insulating medium between said n-type and p-type semiconductor elements to the predetermined thickness to produce an integrated body; selectively forming an upper patterned electrical trace layer upon the integrated body that includes one or more second electrical contacts; and selectively forming an upper surface volume on the integrated body and the one or more second electrical contacts.
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21. A method for forming an integrated microelectronic module including a heat-producing integrated circuit mounted upon, the method comprising:
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selectively forming thermoelectric electrodes for a first thermoelectric circuit that contains embedded micro-channels through which a working fluid can be passed; locating by means of selective deposition alternating regions of n-type and p-type semiconducting elements between the first thermoelectric circuit electrodes to form a series-configured thermoelectric circuit; selectively forming the hot thermoelectric electrodes for one or more second thermoelectric circuits, wherein the hot electrode(s) of the second thermoelectric circuit are positioned in close proximity to the first thermoelectric circuit and contain(s) an embedded micro-channel through which a working fluid can be passed; selectively forming the cold electrode(s) of the second thermoelectric circuit(s) to be in thermal communication with a thermal reservoir; selectively forming n-type and p-type semiconducting elements between the hot and cold electrodes of the second thermoelectric circuit(s); selectively depositing a thermally and electrically insulating material that thermally isolates the electrodes in the first thermoelectric circuit from each other and the one or more second thermoelectric circuit(s) having their hot electrodes positioned in close proximity to the electrodes of the first thermoelectric circuit; forming a micro-channel within the thermally and electrically insulating material through which the working fluid from an electrode in the first thermoelectric is passed to a hot electrode in the second thermoelectric circuit to further thermally isolate the electrodes of the first thermoelectric circuit; configuring the micro-channels in the thermally and electrically insulated material to pass through a fluid pumping station; selectively forming thin film thermocouples upon the electrodes of both thermoelectric circuits; selectively forming contact pads on the electrodes of both thermoelectric circuits; selectively forming patterned traces that electrically connect the thin film thermocouples and the contact pads to a controller circuit; configuring the micro-channels to return cooled fluid to a system of micro-channels in good thermal contact with the heat-producing integrated circuit.
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Specification