×

Semiconductor Device Surface Clean

  • US 20130061876A1
  • Filed: 09/14/2011
  • Published: 03/14/2013
  • Est. Priority Date: 09/14/2011
  • Status: Abandoned Application
First Claim
Patent Images

1. A method for cleaning a semiconductor device, the method comprising:

  • polishing a material away from a first surface of a dielectric layer; and

    buff polishing the first surface of the dielectric layer with a reactant, wherein the buff polishing changes at least a portion of the first surface from hydrophobic to hydrophilic.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×