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METHOD FOR CLEANING WAFER AFTER CHEMICAL MECHANICAL PLANARIZATION

  • US 20130061884A1
  • Filed: 03/23/2012
  • Published: 03/14/2013
  • Est. Priority Date: 06/03/2011
  • Status: Abandoned Application
First Claim
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1. A method for cleaning wafer after chemical mechanical planarization, comprising:

  • Step A, placing the wafer in the wafer holder;

    Step B, driving the wafer rotation part to rotate the wafer holder and the wafer simultaneously;

    Step C, first cleaning with chemicals by providing the wafer surface with chemical detergent through the detergent supply cantilever, which keeps a certain distance away from the wafer surface;

    Step D, first cleaning with deionized water by providing the wafer surface with deionized water through the detergent supply cantilever to remove the chemical detergent and cleaning products;

    Step E, second cleaning for better cleaning effect; and

    Step F, drying the wafer out.

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