METHOD FOR CLEANING WAFER AFTER CHEMICAL MECHANICAL PLANARIZATION
First Claim
1. A method for cleaning wafer after chemical mechanical planarization, comprising:
- Step A, placing the wafer in the wafer holder;
Step B, driving the wafer rotation part to rotate the wafer holder and the wafer simultaneously;
Step C, first cleaning with chemicals by providing the wafer surface with chemical detergent through the detergent supply cantilever, which keeps a certain distance away from the wafer surface;
Step D, first cleaning with deionized water by providing the wafer surface with deionized water through the detergent supply cantilever to remove the chemical detergent and cleaning products;
Step E, second cleaning for better cleaning effect; and
Step F, drying the wafer out.
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Abstract
A method for cleaning wafer after chemical mechanical planarization that includes placing the wafer in the wafer holder and rotating the wafer holder and the wafer simultaneously, cleaning with chemicals by providing the wafer surface with chemical detergent through the detergent supply cantilever that keeps a certain distance away from the wafer surface, cleaning with deionized water by providing the wafer surface with deionized water through the detergent supply cantilever to remove the chemical detergent and cleaning products. The method also includes the second clean for better cleaning effect and drying the wafer out. According to the wafer cleaning method, the non-contact detergent and deionized water supply cantilever used for wafer cleaning reduces or eliminates the possible problems in making macro scratches on wafer surface in the scrubbing process and increases the yield for wafer devices.
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Citations
9 Claims
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1. A method for cleaning wafer after chemical mechanical planarization, comprising:
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Step A, placing the wafer in the wafer holder; Step B, driving the wafer rotation part to rotate the wafer holder and the wafer simultaneously; Step C, first cleaning with chemicals by providing the wafer surface with chemical detergent through the detergent supply cantilever, which keeps a certain distance away from the wafer surface; Step D, first cleaning with deionized water by providing the wafer surface with deionized water through the detergent supply cantilever to remove the chemical detergent and cleaning products; Step E, second cleaning for better cleaning effect; and Step F, drying the wafer out. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification