LIGHT EMITTING DEVICES INCLUDING WAVELENGTH CONVERTING MATERIAL
First Claim
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1. A light emitting device comprising:
- a multi-layer stack of material including a n-doped region, an p-doped region and a light generating region disposed between the n-doped and p-doped regions, wherein at least a portion of the light generated from the light generating region emerges from the light emitting device via a top emission surface of the multi-layer stack of materials; and
a wavelength converting material layer disposed according to a pattern on the top emission surface of the multi-layer stack of material, wherein sidewalls of the multi-layer stack of material are substantially devoid of the wavelength converting material.
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Abstract
Light-emitting devices and associated methods are provided. The light emitting devices can have a wavelength converting material-coated emission surface.
33 Citations
24 Claims
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1. A light emitting device comprising:
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a multi-layer stack of material including a n-doped region, an p-doped region and a light generating region disposed between the n-doped and p-doped regions, wherein at least a portion of the light generated from the light generating region emerges from the light emitting device via a top emission surface of the multi-layer stack of materials; and a wavelength converting material layer disposed according to a pattern on the top emission surface of the multi-layer stack of material, wherein sidewalls of the multi-layer stack of material are substantially devoid of the wavelength converting material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of controlling color point of a wafer, comprising the steps of:
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providing a wafer configured for emitting light; determining a desired color point of light emitted by said wafer; determining the applied thickness and/or pattern of a wavelength converting material to achieve said desired color point; and forming a layer of wavelength converting material having the determined thickness and/or pattern on a top surface of the wafer.
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14-15. -15. (canceled)
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16. A method of forming a light emitting device, comprising the steps of:
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providing a multi-layer stack of material; disposing a wavelength converting material on a top surface of the multi-layer stack of material; and dicing the multi-layer stack of material into a plurality of mesas.
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17-19. -19. (canceled)
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20. A light emitting device comprising:
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a multi-layer stack of material including a n-doped region, an p-doped region and a light generating region disposed between the n-doped and p-doped regions, wherein a portion of the light generated from the light generating region emerges from the light emitting device via a top emission surface of the multi-layer stack of materials; a first wavelength converting material region disposed on at least a portion of the top emission surface and a second wavelength converting material region disposed on at least a portion of the emission surface, wherein the first wavelength converting material is configured to emit light at a different frequency than the second wavelength converting material.
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21-22. -22. (canceled)
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23. A light emitting device comprising:
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a multi-layer stack of material including a n-doped region, an p-doped region and a light generating region disposed between the n-doped and p-doped regions, wherein at least a portion of the light generated from the light generating region emerges from the light emitting device via a top emission surface of the multi-layer stack of materials, wherein a plurality of recesses are formed in the top emission surface; and a wavelength converting material layer disposed in the recesses in the top emission surface.
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24-27. -27. (canceled)
Specification