LIGHT-EMITTING DEVICE

• US 20130062649A1
• Filed: 09/13/2012
• Published: 03/14/2013
• Est. Priority Date: 09/14/2011
• Status: Active Grant

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Toshio Hata
• Inventors: HATA, Toshio, Ito, Masayuki, Miyata, Masataka
• Granted Patent: US 8,785,957 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Disclosed is a light-emitting device having a wide luminous-intensity distribution characteristic with a simple structure. The light-emitting device includes a resin package in which an LED chip, a first inner portion of a first lead terminal, and a second inner portion of a second lead terminal are accommodated and which has a second recess portion formed so that a portion including a first recess portion of the first inner portion of the first lead terminal as well as a portion of the second inner portion of the second lead terminal are exposed to a bottom portion of the second recess portion, and a resin portion containing phosphors and filled in the first recess portion of the first lead terminal and in the second recess portion of the resin package. A photoreflective filler is contained in a region opposed to the LED chip of the resin portion including the phosphors.

Claims

1. A light-emitting device comprising:

a semiconductor light-emitting element;

a lead terminal having a first recess portion for placement of the semiconductor light-emitting element therein;

a resin package in which the semiconductor light-emitting element and a portion of the lead terminal including the first recess portion are accommodated, the resin package also having a second recess portion which is so formed that the portion of the lead terminal including the first recess portion is exposed to a bottom portion of the second recess portion; and

a resin portion containing phosphors filled in the first recess portion of the lead terminal and in the second recess portion of the resin package, wherein

a photoreflective filler is contained in at least a region of the resin portion containing the phosphors that faces the semiconductor light-emitting element.

2. The light-emitting device as claimed in claim 1, wherein

the lead terminal includes:

a first lead terminal which has a first inner portion with a first electrode of the semiconductor light-emitting element connected thereto, and a first outer portion adjoining the first inner portion, and in which the first recess portion is formed in the first inner portion; and

a second lead terminal which has a second inner portion with a second electrode of the semiconductor light-emitting element connected thereto, and a second outer portion adjoining the second inner portion, and

the semiconductor light-emitting element, the first inner portion of the first lead terminal, and the second inner portion of the second lead terminal are accommodated in the resin package, and the second recess portion is so formed that a portion including the first recess portion of the first inner portion of the first lead terminal and a portion of the second inner portion of the second lead terminal are exposed to the bottom portion of the second recess portion.

3. The light-emitting device as claimed in claim 1, wherein

the photoreflective filler is contained in a region of the resin portion containing the phosphors onto which the semiconductor light-emitting element is projected toward a direction generally vertical to a bottom plane of the second recess portion of the resin package.

4. The light-emitting device as claimed in claim 1, wherein

the resin portion containing the phosphors has a convex lens portion protruding toward a direction generally vertical to a bottom plane of the second recess portion of the resin package.

5. The light-emitting device as claimed in claim 1, wherein

the semiconductor light-emitting element is mounted on a bottom face of the first recess portion of the lead terminal.

6. The light-emitting device as claimed in claim 1, wherein

the first recess portion of the lead terminal is positioned on a bottom side of the second recess portion of the resin package.

7. The light-emitting device as claimed in claim 6, wherein

the first recess portion of the lead terminal is positioned at a generally center of the bottom side of the second recess portion of the resin package.

8. The light-emitting device as claimed in claim 1, wherein

the second recess portion of the resin package has a rectangular-shaped opening,

a wall surface of the first recess portion of the lead terminal is a gentle slope surface which is gently sloped so as to gradually broaden from a bottom side toward an opening of the first recess portion of the lead terminal,

a wall surface of the second recess portion of the resin package is a slope surface which is sloped so as to gradually broaden from the bottom side toward the opening of the second recess portion of the resin package, and

light derived from the photoreflective filler of the resin portion containing the phosphors and from the phosphors is reflected by surfaces including, as arranged in order along a longer-side direction of the second recess portion of the resin package, the bottom face and the gentle slope surface of the first recess portion of the lead terminal, a flat surface of the lead terminal, and the slope surface of the second recess portion of the resin package.

9. The light-emitting device as claimed in claim 1, wherein

the second recess portion of the resin package has a rectangular-shaped opening,

a wall surface of the first recess portion of the lead terminal is a gentle slope surface which is gently sloped so as to gradually broaden from a bottom side toward an opening of the first recess portion of the lead terminal,

a wall surface of the second recess portion of the resin package is a slope surface which is sloped so as to gradually broaden from the bottom side toward the opening of the second recess portion of the resin package, and

light derived from the photoreflective filler of the resin portion containing the phosphors and from the phosphors is reflected by surfaces including, as arranged in order along a shorter-side direction of the second recess portion of the resin package, the bottom face and the gentle slope surface of the first recess portion of the lead terminal, a flat surface of the lead terminal, and the slope surface of the second recess portion of the resin package.

10. The light-emitting device as claimed in claim 8, wherein

a portion having the bottom face and the gentle slope surface of the first recess portion of the lead terminal, and a portion having the flat surface of the lead terminal are made from metal or a layer containing metal.

11. The light-emitting device as claimed in claim 9, wherein

a portion having the bottom face and the gentle slope surface of the first recess portion of the lead terminal, and a portion having the flat surface of the lead terminal are made from metal or a layer containing metal.

12. The light-emitting device as claimed in claim 8, wherein

the bottom face and the gentle slope surface of the first recess portion of the lead terminal, and the flat surface of the lead terminal are continuously formed by an identical material.

13. The light-emitting device as claimed in claim 9, wherein

the bottom face and the gentle slope surface of the first recess portion of the lead terminal, and the flat surface of the lead terminal are continuously formed by an identical material.

14. The light-emitting device as claimed in claim 1, wherein

the photoreflective filler is contained near a surface of the resin portion containing the phosphors and in a region opposed to the first recess portion of the lead terminal.

15. The light-emitting device as claimed in claim 1, wherein

in the resin portion containing the phosphors, the phosphors are distributed on a bottom side of the second recess portion of the resin package, and the photoreflective filler is contained in a region near a surface of the resin portion containing the phosphors.

16. The light-emitting device as claimed in claim 1, wherein

in the resin portion containing the phosphors, the phosphors are distributed so as to be dispersed all over the resin portion, and

the photoreflective filler is contained near a surface of the resin portion containing the phosphors and in a region opposed to the first recess portion of the lead terminal.