Power Module and Power Module Manufacturing Method
First Claim
1. A power module comprising:
- a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on an opposite side of the first surface; and
a case for housing the sealing body, whereinthe case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate,the intermediate member has a first thin section having thickness smaller than thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate, andthe sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section.
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Accused Products
Abstract
A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate. The sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section.
60 Citations
13 Claims
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1. A power module comprising:
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a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on an opposite side of the first surface; and a case for housing the sealing body, wherein the case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate, the intermediate member has a first thin section having thickness smaller than thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate, and the sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A manufacturing method for a power module including:
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a sealing body including a semiconductor element, a conductor plate connected to an electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case including a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate and in which an opening for inserting the sealing body is formed, the manufacturing method comprising; a first step of elastically deforming, when a distance between an opposed surface of the first heat radiation plate and an opposed surface of the second heat radiation plate is defined as D and thickness of the sealing body is defined as T, a part of the intermediate member of the case such that, in the case formed to have the D smaller than the T, the D changes to D1 larger than the T; a second step of inserting the sealing body from the opening of the case; and a third step of releasing pressurizing force for elastically deforming the part of the intermediate member in the first step such that the D approaches the T from the D1.
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13. A manufacturing method for a power module including:
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a sealing body including a semiconductor element, a conductor plate connected to an electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the conductor plate, the sealing body having a first concave section formed on one surface and a second concave section formed on the other surface on the opposite side of the one surface, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case including a first heat radiation plate opposed to the first surface of the sealing body and fit in the first concave section, a second heat radiation plate opposed to the second surface of the sealing body and fit in the second concave section, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate and in which an opening for inserting the sealing body is formed, the manufacturing method comprising; a first step of elastically deforming, when a distance between an opposed surface of the first heat radiation plate and an opposed surface of the second heat radiation plate is defined as D, a distance between a bottom of the first concave section and a bottom of the second concave section of the sealing body is defined as T1, and thickness of the sealing body is defined as T2, a part of the intermediate member of the case with pressing force of the sealing body inserted from the opening of the case such that, in the case formed to have the D smaller than the T1, the D changes to D1 larger than the T2; and a second step of fitting the first heat radiation plate in the first concave section of the sealing body and fitting the second heat radiation plate in the second concave section of the sealing body.
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Specification